公开(公告)号：US10008252B2

公开(公告)日：2018-06-26

申请号：US15477619

申请日：2017-04-03

申请人： SK hynix Inc.

发明人： Sang-Ah Hyun ,  Tae-Jin Kang ,  Hyun-Seung Kim ,  Nam-Kyu Jang ,  Won-Seok Choi ,  Won-Kyung Chung ,  Seung-Hun Lee

IPC分类号： G11C7/00 ,  G11C11/35 ,  G11C7/22 ,  G11C11/404 ,  G11C11/406 ,  G11C11/408 ,  G11C11/4093

CPC分类号： G11C11/35 ,  G11C5/06 ,  G11C7/1045 ,  G11C7/1057 ,  G11C7/1084 ,  G11C7/109 ,  G11C7/22 ,  G11C11/404 ,  G11C11/40607 ,  G11C11/4082 ,  G11C11/4093 ,  G11C16/26 ,  G11C29/021 ,  G11C29/028 ,  G11C2207/105

摘要： A semiconductor system may include: an external channel including a CA (Command/Address) channel, and first and second data channels; and first and second semiconductor chips, which are coupled in common to the CA channel and coupled to respective different ones of the first and second data channels, and each of which includes a coupling information pad. A first value may be inputted to the coupling information pad of one of the first and second semiconductor chips that is coupled to the first data channel, and a second value may be inputted to the coupling information pad of the other semiconductor chip that is coupled to the second data channel. Each of the first and second semiconductor chips selectively stores setting information using CA information applied to the CA channel and a value inputted to the corresponding coupling information pad.