公开(公告)号：US20160065153A1

公开(公告)日：2016-03-03

申请号：US14836972

申请日：2015-08-27

Applicant: SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK

Inventor： Jong Hoon PARK ,  Chang Hyun LEE ,  Chang Kun PARK

IPC: H03F3/21 ,  H03F1/34

CPC classification number: H03F1/342 ,  H03F1/223 ,  H03F3/195 ,  H03F3/245 ,  H03F3/3028 ,  H03F2200/408 ,  H03F2200/411 ,  H03F2203/30031

Abstract: The present disclosure relates to an inverter type power amplifier. An exemplary embodiment of the present disclosure provides an inverter type power amplifier including: a first transistor including a gate to which an AC type of input signal is applied through an input port, a first terminal connected a power source voltage, and a second terminal connected to an output port; a second transistor including a gate through which the input signal is applied thereto, a first terminal connected to a ground, and a second terminal connected to the output port; a feedback resistor including a first terminal connected to the input port and a second terminal connected to the output port; and an AC blocking block including a first terminal connected to the output port and a second terminal connected to a DC output port.

Abstract translation: 本公开涉及一种逆变器型功率放大器。 本公开的示例性实施例提供了一种逆变器型功率放大器，包括：第一晶体管，包括栅极，通过输入端口施加AC型输入信号，第一端子连接电源电压，第二端子连接 到输出端口; 第二晶体管，包括施加输入信号的栅极，连接到地的第一端子和连接到输出端口的第二端子; 反馈电阻器，包括连接到输入端口的第一端子和连接到输出端口的第二端子; 以及包括连接到输出端口的第一端子和连接到DC输出端口的第二端子的AC阻断块。

公开(公告)号：US20150054710A1

公开(公告)日：2015-02-26

申请号：US14468330

申请日：2014-08-26

Applicant: SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK

Inventor： Chang Hyun LEE ,  Chang Kun Park

IPC: H01F38/14 ,  H01Q1/38 ,  H01Q21/28 ,  H02J5/00

CPC classification number: H01F38/14 ,  H01Q1/2283 ,  H01Q21/28 ,  H02J5/005 ,  H02J50/05 ,  H02J50/10 ,  H02J50/40

Abstract: Disclosed is an antenna for inter-chip wireless power transmission in a 3D-wireless chip package, wherein the 3D-wireless chip package includes: a first chip transmitting AC power through a transmitting antenna; and a plurality of second chips sequentially stacked on or under the first chip and receiving the AC power from the first chip through receiving antennas, respectively, and the receiving antennas are individually formed on the second chips, respectively, and positioned without vertically overlapping each other over or under the transmitting antenna.

Abstract translation: 公开了一种用于3D无线芯片封装中的芯片间无线电力传输的天线，其中3D无线芯片封装包括：通过发射天线发射AC电力的第一芯片; 以及分别依次堆叠在第一芯片上或下面的多个第二芯片，并且分别通过接收天线从第一芯片接收AC电力，并且接收天线分别形成在第二芯片上并且彼此不垂直重叠地定位 在发射天线之上或之下。