公开(公告)号：US12028990B2

公开(公告)日：2024-07-02

申请号：US17371327

申请日：2021-07-09

Applicant: STEMCO CO., LTD.

Inventor： Sung Jin Lee ,  Young Jun Kim ,  Su Jeong Shin

IPC: H05K1/09 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4644 ,  H05K1/09 ,  H05K3/282 ,  H05K3/38 ,  H05K2201/0352 ,  H05K2201/09509

Abstract: Provided are a multilayer board and a method for manufacturing same, in which a different kind of metal layer is formed between an upper metal layer and an interlayer insulating layer, the different kind of metal layer being formed only in a wiring area without being formed in a via area. The multilayer board comprises: a substrate layer; a plurality of first metal layers sequentially stacked on the substrate layer; an interlayer insulating layer formed between two different first metal layers, having a first via hole, and electrically connecting the two different first metal layers through a third metal layer formed in the first via hole; and a second metal layer formed between the upper layer of the two different first metal layers and the interlayer insulating layer.

公开(公告)号：US11956904B2

公开(公告)日：2024-04-09

申请号：US16952021

申请日：2020-11-18

Applicant: STEMCO CO., LTD.

Inventor： Jae Soo Lee ,  Hyo Jin Park ,  Sung Jin Lee ,  Dong Gon Kim

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4602 ,  H05K1/0298 ,  H05K3/4655 ,  H05K2201/0959 ,  H05K2203/13

Abstract: The present invention provides a multilayer circuit board and a method for manufacturing the same for improving a bowing problem that occurs when manufacturing the multilayer circuit board. A multilayer circuit board according to the present invention is a board having a patterned layer that functions as a circuit a base layer, and includes: a second pattern layer formed on one side of the base layer; a first pattern layer formed on the second pattern layer; and an interlayer insulating layer formed between the first pattern layer and the second pattern layer, the interlayer insulating layer being partially formed on the second pattern layer so as to correspond to a region where the first pattern layer is formed.