公开(公告)号：US20030119219A1

公开(公告)日：2003-06-26

申请号：US10308482

申请日：2002-12-03

Applicant: STMICROELECTRONICS S.A.

Inventor： Alexis Farcy ,  Philippe Coronel ,  Pascal Ancey ,  Joaquin Torres

IPC: H01L021/00 ,  H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: B81C1/0023 ,  B29C2043/5825

Abstract: The fabrication of an integrated circuit includes a first phase of producing an electronic chip and a second phase of producing at least one auxiliary component placed above the chip and of producing a protective cover which covers the auxiliary component. The first phase of producing the chip is effected from a first semiconductor substrate and comprises the formation of a cavity lying in a chosen region of the chip and emerging at the upper surface of the chip. The second production phase includes the production of the auxiliary component from a second semiconductor substrate, separate from the first, and then the placement in the cavity of the auxiliary component supported by the second substrate and the mutual adhesion of the second substrate to the upper surface of the chip lying outside the cavity. The second substrate then also forms the protective cover.

Abstract translation: 集成电路的制造包括制造电子芯片的第一阶段和产生放置在芯片上方的至少一个辅助部件并产生覆盖辅助部件的保护盖的第二阶段。 制造芯片的第一阶段从第一半导体衬底实现，并且包括形成位于芯片的选定区域中并且出现在芯片的上表面处的空腔。 第二生产阶段包括从第二半导体衬底生产辅助部件，与第一半导体衬底分离，然后放置在由第二衬底支撑的辅助部件的空腔中，以及将第二衬底与上表面的相互粘合 的芯片位于腔外。 第二基板然后也形成保护盖。

公开(公告)号：US20040251781A1

公开(公告)日：2004-12-16

申请号：US10814619

申请日：2004-03-31

Applicant: STMicroelectronics S.A.

Inventor： Guillaume Bouche ,  Pascal Ancey ,  Gregory Caruyer

IPC: H01L041/04

CPC classification number: B81B3/0078 ,  B81B2201/0271 ,  B81B2201/032 ,  B81B2203/0109 ,  H01G5/16 ,  H03H9/172 ,  H03H2009/02181

Abstract: A device comprising a resonator formed of a piezoelectric layer sandwiched between two metal electrodes, the resonator being laid on a suspended beam, the device comprising means for deforming said beam by the difference in thermal expansion coefficients.

Abstract translation: 一种包括由夹在两个金属电极之间的压电层形成的谐振器的装置，所述谐振器被放置在悬挂梁上，所述装置包括用于使所述光束变形所述热膨胀系数的差异的装置。