公开(公告)号：US20160347606A1

公开(公告)日：2016-12-01

申请号：US14962945

申请日：2015-12-08

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giuseppe BRUNO ,  Sebastiano CONTI ,  Mario CHIRICOSTA ,  Michele VAIANA ,  Calogero Marco IPPOLITO ,  Mario MAIORE ,  Daniele CASELLA

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B7/02 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2207/094 ,  G01L19/0092 ,  G01N27/223 ,  H01L23/3121 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.

Abstract translation: 包装传感器组件包括：具有至少一个开口的包装结构; 湿度传感器和压力传感器，其容纳在包装结构内并通过开口与外部流体连通;以及控制电路，可操作地耦合到湿度传感器和压力传感器; 其中所述湿度传感器和所述控制电路集成在第一芯片中，并且所述压力传感器集成在与所述第一芯片不同的第二芯片中并且被结合到所述第一芯片。