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公开(公告)号：US20180176693A1
公开(公告)日：2018-06-21
申请号：US15814256
申请日：2017-11-15
Applicant: STMICROELECTRONICS S.R.L. , OMRON CORPORATION
Inventor： Takashi KASAI , Shobu SATO , Yuki UCHIDA , Igino PADOVANI , Filippo DAVID , Sebastiano CONTI
CPC classification number: H04R19/04 , B81B3/0021 , H04R1/023 , H04R1/086 , H04R3/00 , H04R3/005 , H04R19/005 , H04R19/016 , H04R31/00 , H04R2201/003 , H04R2499/11
Abstract: Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.
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2.发明申请公开(公告)号：US20200148530A1
公开(公告)日：2020-05-14
申请号：US16730480
申请日：2019-12-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Bruno MURARI , Sebastiano CONTI
Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.
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3.发明申请公开(公告)号：US20180124521A1
公开(公告)日：2018-05-03
申请号：US15629518
申请日：2017-06-21
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Domenico GIUSTI , Sebastiano CONTI
IPC: H04R17/02 , B81C1/00 , B81B3/00 , H01L41/113 , H01L41/312 , H01L41/04 , H04R31/00
CPC classification number: H04R17/02 , B81B3/0037 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81B2207/012 , B81C1/00158 , G01L9/0042 , G01L9/0073 , H01L41/042 , H01L41/1132 , H01L41/1138 , H01L41/312 , H04R19/005 , H04R19/04 , H04R31/003 , H04R2201/003
Abstract: A MEMS sensor, in particular a microphone, of a piezoelectric type, formed in a membrane of semiconductor material accommodating a compliant portion, which extends from a first surface to a second surface of the membrane. The compliant portion has a Young's modulus lower than the rest of the membrane. A sensitive region having piezoelectric material extends on the first surface, over the compliant portion and is fixed at its ends to the membrane on opposite sides of the compliant portion. A third area of the membrane, arranged between the compliant portion and the second surface, forms a hinge element.
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4.发明申请MICROELECTROMECHANICAL SENSOR DEVICE WITH REDUCED STRESS-SENSITIVITY AND CORRESPONDING MANUFACTURING PROCESS 有权具有降低应力敏感性的微电子传感器装置和相应的制造工艺公开(公告)号：US20170073220A1
公开(公告)日：2017-03-16
申请号：US15074755
申请日：2016-03-18
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Sebastiano CONTI
IPC: B81B7/00
CPC classification number: B81B7/0054 , B81B3/0051 , B81B7/0048 , B81B7/008 , B81B2201/0264 , B81C1/00325 , H01L2224/48091 , H01L2924/00014
Abstract: A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.
Abstract translation: MEMS装置设置有：支撑基座，其具有与外部环境接触的底面; 传感器芯片，其是半导体材料并且集成了微机械检测结构; 传感器框架，其布置在所述传感器模具周围并且机械地联接到所述支撑基座的顶表面; 以及盖，其布置在传感器模具的上方并且机械地联接到传感器框架的顶表面，盖的顶表面与外部环境接触。 传感器模具与传感器框架机械分离。
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5.发明申请公开(公告)号：US20180148321A1
公开(公告)日：2018-05-31
申请号：US15880332
申请日：2018-01-25
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Sebastiano CONTI
CPC classification number: B81B7/0054 , B81B3/0051 , B81B7/0048 , B81B7/008 , B81B2201/0264 , B81C1/00325 , H01L2224/48091 , H01L2924/00014
Abstract: A MEMS device is provided with: a supporting base, having a bottom surface in contact with an external environment; a sensor die, which is of semiconductor material and integrates a micromechanical detection structure; a sensor frame, which is arranged around the sensor die and is mechanically coupled to a top surface of the supporting base; and a cap, which is arranged above the sensor die and is mechanically coupled to a top surface of the sensor frame, a top surface of the cap being in contact with an external environment. The sensor die is mechanically decoupled from the sensor frame.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20180148316A1
公开(公告)日：2018-05-31
申请号：US15884624
申请日：2018-01-31
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Bruno MURARI , Sebastiano CONTI
CPC classification number: B81B3/0021 , B81B3/0094 , B81B7/0041 , B81B2201/0264
Abstract: A packaged pressure sensor, comprising: a MEMS pressure-sensor chip; and an encapsulating layer of elastomeric material, in particular PDMS, which extends over the MEMS pressure-sensor chip and forms a means for transferring a force, applied on a surface thereof, towards the MEMS pressure-sensor chip.
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公开(公告)号：US20160347606A1
公开(公告)日：2016-12-01
申请号：US14962945
申请日：2015-12-08
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giuseppe BRUNO , Sebastiano CONTI , Mario CHIRICOSTA , Michele VAIANA , Calogero Marco IPPOLITO , Mario MAIORE , Daniele CASELLA
IPC: B81B7/00
CPC classification number: B81B7/007 , B81B7/02 , B81B2201/0264 , B81B2201/0292 , B81B2207/094 , G01L19/0092 , G01N27/223 , H01L23/3121 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
Abstract: A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.
Abstract translation: 包装传感器组件包括：具有至少一个开口的包装结构; 湿度传感器和压力传感器，其容纳在包装结构内并通过开口与外部流体连通;以及控制电路，可操作地耦合到湿度传感器和压力传感器; 其中所述湿度传感器和所述控制电路集成在第一芯片中，并且所述压力传感器集成在与所述第一芯片不同的第二芯片中并且被结合到所述第一芯片。
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公开(公告)号：US20200003831A1
公开(公告)日：2020-01-02
申请号：US16451660
申请日：2019-06-25
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Paolo ARANZULLA , Fabiano FRIGOLI , Massimo GREPPI , Marco CAMERANI , Sebastiano CONTI , Guglielmo ROCCASALVO , Enrico Rosario ALESSI , Massimiliano PESATURO
Abstract: A method for testing the hermetic seal of a packaged device, which includes: a package that delimits a device chamber; and a transducer device, which is arranged within the device chamber and generates an electrical signal indicating at least one physical quantity external to the package. The testing method includes the steps of: imposing a reference pressure in the device chamber; arranging the packaged device in a testing chamber in which a testing pressure is present, different from the reference pressure; and subsequently detecting possible pressure variations within the device chamber.
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9.发明申请公开(公告)号：US20170339494A1
公开(公告)日：2017-11-23
申请号：US15365590
申请日：2016-11-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo PERLETTI , Igor VARISCO , Luca LAMAGNA , Silvia ADORNO , Gabriele GATTERE , Carlo VALZASINA , Sebastiano CONTI
CPC classification number: H04R19/005 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0136 , B81B2203/0315 , B81B2203/04 , B81B2203/053 , B81C1/00158 , B81C2201/0109 , B81C2201/0111 , B81C2201/0133 , G01H11/06 , H04R31/00 , H04R2201/003 , H04R2201/023
Abstract: A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.
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公开(公告)号：US20170247249A1
公开(公告)日：2017-08-31
申请号：US15276613
申请日：2016-09-26
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Enri DUQI , Sebastiano CONTI , Lorenzo BALDO , Flavio Francesco VILLA
CPC classification number: B81B7/0038 , B81B3/0086 , B81B7/0019 , B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81C1/00269
Abstract: A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.
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