公开(公告)号：US09922947B2

公开(公告)日：2018-03-20

申请号：US15141621

申请日：2016-04-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario Vitello ,  Federico Frego ,  Salvatore Latino

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

CPC classification number: H01L24/05 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05011 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05097 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/48463 ,  H01L2924/3512

Abstract: Various embodiments provide a bonding pad structure that is capable of handling increased bonding loads. In one embodiment, the bonding pad structure includes a continuous metal layer, a first discontinuous metal layer, a second discontinuous metal layer, and dielectric material. The first discontinuous metal layer and the second discontinuous metal layer each include a plurality of holes that are arranged in a pattern. The plurality of holes of the first discontinuous metal layer overlaps at least two of the plurality of holes of the second discontinuous metal layer. The dielectric material is formed between the metal layers and fills the plurality of holes of the first and second discontinuous metal layers.

公开(公告)号：US20170317039A1

公开(公告)日：2017-11-02

申请号：US15141621

申请日：2016-04-28

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario Vitello ,  Federico Frego ,  Salvatore Latino

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05011 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05097 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/48463 ,  H01L2924/3512

Abstract: Various embodiments provide a bonding pad structure that is capable of handling increased bonding loads. In one embodiment, the bonding pad structure includes a continuous metal layer, a first discontinuous metal layer, a second discontinuous metal layer, and dielectric material. The first discontinuous metal layer and the second discontinuous metal layer each include a plurality of holes that are arranged in a pattern. The plurality of holes of the first discontinuous metal layer overlaps at least two of the plurality of holes of the second discontinuous metal layer. The dielectric material is formed between the metal layers and fills the plurality of holes of the first and second discontinuous metal layers.