公开(公告)号：US10345158B2

公开(公告)日：2019-07-09

申请号：US14958620

申请日：2015-12-03

Applicant: STMicroelectronics S.R.L.

Inventor： Lorenzo Maurizio Selgi ,  Davide Giuseppe Patti

IPC: G01K7/00 ,  G01K3/00 ,  G01K7/01 ,  H01L27/08 ,  G01K3/14

Abstract: An integrated electronic device including an electronic component and a temperature transducer formed in a first die. The temperature transducer including a first diode and a second diode which are connected in antiparallel.

公开(公告)号：US20160313755A1

公开(公告)日：2016-10-27

申请号：US14970999

申请日：2015-12-16

Applicant: STMicroelectronics S.R.L.

Inventor： Davide Giuseppe Patti ,  Lorenzo Maurizio Selgi

IPC: G05F5/00 ,  G01K7/01

CPC classification number: G05F5/00 ,  G01K7/01

Abstract: An integrated electronic device includes an electronic component and a temperature transducer. The temperature transducer is electrically arranged between a control terminal and a conduction terminal of the electronic component and includes a first diode. The first diode has a bulk resistance of at least 1Ω.

Abstract translation: 集成电子设备包括电子部件和温度传感器。 温度传感器电气地布置在电子部件的控制端子和导电端子之间，并且包括第一二极管。 第一个二极管的体电阻至少为1Ω。

公开(公告)号：US09785182B2

公开(公告)日：2017-10-10

申请号：US14970999

申请日：2015-12-16

Applicant: STMicroelectronics S.R.L.

Inventor： Davide Giuseppe Patti ,  Lorenzo Maurizio Selgi

IPC: G05F5/00 ,  G01K7/01

CPC classification number: G05F5/00 ,  G01K7/01

Abstract: An integrated electronic device includes an electronic component and a temperature transducer. The temperature transducer is electrically arranged between a control terminal and a conduction terminal of the electronic component and includes a first diode. The first diode has a bulk resistance of at least 1 kΩ.

公开(公告)号：US20160299013A1

公开(公告)日：2016-10-13

申请号：US14958620

申请日：2015-12-03

Applicant: STMicroelectronics S.R.L.

Inventor： Lorenzo Maurizio Selgi ,  Davide Giuseppe Patti

IPC: G01K7/01 ,  H01L27/08

CPC classification number: G01K7/015 ,  G01K3/14 ,  G01K7/01 ,  H01L27/0814

Abstract: An integrated electronic device including an electronic component and a temperature transducer formed in a first die. The temperature transducer including a first diode and a second diode which are connected in antiparallel.

Abstract translation: 一种集成电子设备，包括形成在第一管芯中的电子部件和温度传感器。 温度传感器包括反平行连接的第一二极管和第二二极管。