公开(公告)号：US20040096964A1

公开(公告)日：2004-05-20

申请号：US10706246

申请日：2003-11-12

Applicant: STMicroelectronics S.r.1.

Inventor： Ubaldo Mastromattteo ,  Flavio Villa ,  Gabriele Barlocchi

IPC: C12M001/34 ,  C12M001/38

CPC classification number: B65D73/00 ,  A01G9/026 ,  B01J19/0093 ,  B01J2219/00873 ,  B01J2219/00961 ,  B01L3/5025 ,  B01L3/502707 ,  B01L3/502715 ,  B01L7/52 ,  B01L2200/12 ,  B01L2200/147 ,  B01L2300/0816 ,  B01L2300/1827 ,  B26D1/245 ,  B29C53/04 ,  B29C61/02 ,  B29L2009/00 ,  B32B3/28 ,  B32B7/02 ,  B32B37/144 ,  B32B38/1866 ,  B32B2307/736 ,  B44C3/04 ,  B44C3/044 ,  B44C3/087 ,  B44C5/005 ,  B44C5/06 ,  B44F1/14 ,  F28F2260/02 ,  Y10T156/1041 ,  Y10T156/1051 ,  Y10T156/1052 ,  Y10T428/2443

Abstract: The integrated device for amplification and other biological tests comprises a semiconductor material body having a surface; a plurality of buried channels extending in the semiconductor material body at a distance from the surface of the semiconductor material body; inlet and outlet ports extending from the surface of the semiconductor material body as far as the ends of the buried channels and being in fluid connection with the buried channels; and heating elements on the semiconductor material body. Temperature sensors are arranged between the heating elements above the surface of the semiconductor material body.

Abstract translation: 用于放大和其他生物测试的集成装置包括具有表面的半导体材料体; 多个掩埋沟道，其在半导体材料体的与半导体材料体的表面相距一定距离处延伸; 入口和出口从半导体材料体的表面延伸到埋入通道的端部并与埋入通道流体连接; 以及半导体材料体上的加热元件。 温度传感器布置在半导体材料体表面之上的加热元件之间。