公开(公告)号：US20190088503A1

公开(公告)日：2019-03-21

申请号：US16195769

申请日：2018-11-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mauro Mazzola ,  Battista Vitali ,  Matteo De Santa

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/492 ,  H01L23/482 ,  H01L21/56 ,  H01L23/00

Abstract: A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

公开(公告)号：US10141197B2

公开(公告)日：2018-11-27

申请号：US15085285

申请日：2016-03-30

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro Mazzola ,  Battista Vitali ,  Matteo De Santa

IPC: H01L23/495 ,  H01L23/48 ,  H01L29/40 ,  H01L23/02 ,  H01L23/52 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/482 ,  H01L23/492

Abstract: A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

公开(公告)号：US20170287730A1

公开(公告)日：2017-10-05

申请号：US15085285

申请日：2016-03-30

Applicant: STMicroelectronics S.r.l.

Inventor： Mauro Mazzola ,  Battista Vitali ,  Matteo De Santa

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/482 ,  H01L23/492 ,  H01L23/31

CPC classification number: H01L21/4828 ,  H01L21/4825 ,  H01L21/4832 ,  H01L21/4875 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3171 ,  H01L23/4822 ,  H01L23/4924 ,  H01L23/49582 ,  H01L24/10 ,  H01L2224/16245 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

公开(公告)号：US10741415B2

公开(公告)日：2020-08-11

申请号：US16195769

申请日：2018-11-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Mauro Mazzola ,  Battista Vitali ,  Matteo De Santa

IPC: H01L23/495 ,  H01L23/48 ,  H01L29/40 ,  H01L23/02 ,  H01L23/52 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/482 ,  H01L23/492

Abstract: A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.