-
公开(公告)号:US11965906B2
公开(公告)日:2024-04-23
申请号:US17866378
申请日:2022-07-15
Applicant: STMicroelectronics S.r.l.
Inventor: Gabriele Gattere , Jean Marie Darmanin , Francesco Rizzini , Carlo Valzasina
IPC: G01P15/125 , G01P1/00 , G01P15/08 , G01P15/13
CPC classification number: G01P15/125 , G01P1/00 , G01P15/0802 , G01P15/131 , G01P2015/0831
Abstract: A closed-loop microelectromechanical accelerometer includes a substrate of semiconductor material, an out-of-plane sensing mass and feedback electrodes. The out-of-plane sensing mass, of semiconductor material, has a first side facing the supporting body and a second side opposite to the first side. The out-of-plane sensing mass is also connected to the supporting body to oscillate around a non-barycentric fulcrum axis parallel to the first side and to the second side and perpendicular to an out-of-plane sensing axis. The feedback electrodes are capacitively coupled to the sensing mass and are configured to apply opposite electrostatic forces to the sensing mass.
-
公开(公告)号:US11698388B2
公开(公告)日:2023-07-11
申请号:US17122793
申请日:2020-12-15
Applicant: STMicroelectronics S.r.l.
Inventor: Jean Marie Darmanin , Carlo Valzasina , Alessandro Tocchio , Gabriele Gattere
IPC: G01P15/125 , G01P15/00
CPC classification number: G01P15/125
Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.
-