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公开(公告)号：US11408904B2
公开(公告)日：2022-08-09
申请号：US16726024
申请日：2019-12-23
IPC分类号： G01P15/00 , G01P1/00 , G01P15/125 , G01P15/08
摘要： The accelerometric sensor has a suspended region, mobile with respect to a supporting structure, and a sensing assembly coupled to the suspended region and configured to detect a movement of the suspended region with respect to the supporting structure. The suspended region has a geometry variable between at least two configurations associated with respective centroids, different from each other. The suspended region is formed by a first region rotatably anchored to the supporting structure and by a second region coupled to the first region through elastic connection elements configured to allow a relative movement of the second region with respect to the first region. A driving assembly is coupled to the second region so as to control the relative movement of the latter with respect to the first region.
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公开(公告)号：US11015933B2
公开(公告)日：2021-05-25
申请号：US16664041
申请日：2019-10-25
IPC分类号： G01C19/5712
摘要： A micromechanical detection structure includes a substrate of semiconductor material and a driving-mass arrangement is coupled to a set of driving electrodes and driven in a driving movement following upon biasing of the set of driving electrodes. A first anchorage unit is coupled to the driving-mass arrangement for elastically coupling the driving-mass arrangement to the substrate at first anchorages. A driven-mass arrangement is elastically coupled to the driving-mass arrangement by a coupling unit and designed to be driven by the driving movement. A second anchorage unit is coupled to the driven-mass arrangement for elastically coupling the driven-mass arrangement to the substrate at second anchorages. Following upon the driving movement, the resultant of the forces and of the torques exerted on the substrate at the first and second anchorages is substantially zero.
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公开(公告)号：US10054471B2
公开(公告)日：2018-08-21
申请号：US14498966
申请日：2014-09-26
发明人： Dario Paci , Francesco Procopio , Carlo Valzasina , Paolo Angelini , Francesco Diazzi , Roberto Pio Baorda , Danilo Karim Kaddouri
CPC分类号： G01D18/00 , B81B2207/012 , B81B2207/03 , B81C99/003 , G01K13/00 , G01R33/0017 , G01R33/09 , H05B3/16
摘要： An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.
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公开(公告)号：US10031155B2
公开(公告)日：2018-07-24
申请号：US14971155
申请日：2015-12-16
摘要： The piezoelectric sensor is formed in a semiconductor material chip having a surface defining a plane and integrating a structure for sensing forces acting in the plane. The chip is formed by a substrate defining a cantilever having a first end, constrained to an anchorage portion of the substrate, and a second end, which is free to bend under the action of external forces. The cantilever has first and second longitudinal halves, each carrying a respective strip element of piezoelectric material, which extends parallel to the chip plane.
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5.发明申请公开(公告)号：US20180094929A1
公开(公告)日：2018-04-05
申请号：US15466722
申请日：2017-03-22
IPC分类号： G01C19/574
摘要： A MEMS device including a main die that may be coupled to a secondary die, which forms a frame, and at least one first mobile mass elastically coupled to the frame, the main die forming: a driving stage that drives the first mobile mass so that it oscillates, parallel to a first direction, with frequency-modulated displacements; and a processing stage, which generates an output signal indicating an angular velocity of the MEMS device as a function of displacements parallel to a second direction that are made by the first mobile mass, when driven by the driving stage, on account of a Coriolis force.
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公开(公告)号：US20180033564A1
公开(公告)日：2018-02-01
申请号：US15470431
申请日：2017-03-27
发明人： Giovanni Campardo , Carlo Valzasina
CPC分类号： H01H1/0036 , B81B7/0003 , B81B7/007 , B81B7/04 , B81B2201/01 , B81B2203/0118 , B81B2207/01 , H01H1/0094 , H01H59/0009 , H01H2001/0042 , H01H2001/0068 , H01H2001/0078 , H01H2001/145
摘要： A microelectromechanical device, in particular a non-volatile memory module or a relay, comprising: a mobile body including a top region and a bottom region; top electrodes facing the top region; and bottom electrodes, facing the bottom region. The mobile body is, in a resting condition, at a distance from the electrodes. The latter can be biased for generating a movement of the mobile body for causing a direct contact of the top region with the top electrodes and, in a different operating condition, a direct contact of the bottom region with the bottom electrodes. In the absence of biasing, molecular-attraction forces maintain in stable mutual contact the top region and the top electrodes or, alternatively, the bottom region and the bottom electrodes.
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7.发明授权公开(公告)号：US09452922B2
公开(公告)日：2016-09-27
申请号：US13922033
申请日：2013-06-19
CPC分类号： B81B7/0074 , B81B7/007 , B81B7/008 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/092 , B81B2207/093 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C2203/0118 , B81C2203/0792 , H01L2924/0002 , H01L2924/00
摘要： A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
摘要翻译： 微机电装置包括：容纳微机电结构的主体; 以及盖，其结合到主体并通过导电接合区域电耦合到微机电结构。 盖包括选择模块，其具有耦合到微机电结构的第一选择端子，第二选择端子和至少一个控制端子，并且可以通过控制端子控制以将第二选择端子耦合到相应的第一选择端子， 选择性地，对应于相应的操作条件的多个耦合配置之一。
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8.发明申请MICRO-ELECTRO-MECHANICAL DEVICE WITH COMPENSATION OF ERRORS DUE TO DISTURBANCE FORCES, SUCH AS QUADRATURE COMPONENTS 有权微机电装置补偿由于干扰力等因素造成的错误，如作为平衡部件公开(公告)号：US20150377624A1
公开(公告)日：2015-12-31
申请号：US14750840
申请日：2015-06-25
IPC分类号： G01C19/5712
CPC分类号： G01C19/5712 , B81B3/0018 , B81B3/0086 , B81B2201/025 , B81B2203/0163 , G01C19/5733 , G01C19/5747
摘要： MEMS device having a support region elastically carrying a suspended mass through first elastic elements. A tuned dynamic absorber is elastically coupled to the suspended mass and configured to dampen quadrature forces acting on the suspended mass at the natural oscillation frequency of the dynamic absorber. The tuned dynamic absorber is formed by a damping mass coupled to the suspended mass through second elastic elements. In an embodiment, the suspended mass and the damping mass are formed in a same structural layer, for example of semiconductor material, and the damping mass is surrounded by the suspended mass.
摘要翻译： MEMS器件具有通过第一弹性元件弹性地携带悬挂质量的支撑区域。 调谐动态吸收器弹性耦合到悬挂质量并且被配置为在动态吸收体的固有振荡频率下抑制作用在悬浮质量上的正交力。 调谐动态吸收器由通过第二弹性元件联接到悬挂质量的阻尼物质形成。 在一个实施例中，悬挂质量和阻尼质量形成在相同的结构层中，例如半导体材料，并且阻尼块被悬挂质量包围。
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公开(公告)号：US11277112B2
公开(公告)日：2022-03-15
申请号：US16991820
申请日：2020-08-12
摘要： A microelectromechanical device having a mobile structure including mobile arms formed from a composite material and having a fixed structure including fixed arms capacitively coupled to the mobile arms. The composite material includes core regions of insulating material and a silicon coating.
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公开(公告)号：US11274036B2
公开(公告)日：2022-03-15
申请号：US16815883
申请日：2020-03-11
摘要： A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
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