公开(公告)号：US20210188620A1

公开(公告)日：2021-06-24

申请号：US17126903

申请日：2020-12-18

Applicant: STMicroelectronics S.r.l.

Inventor： Luca SEGHIZZI ,  Nicolo' BONI ,  Laura OGGIONI ,  Roberto CARMINATI ,  Marta CARMINATI

IPC: B81B3/00 ,  B81C1/00

Abstract: For manufacturing an optical microelectromechanical device, a first wafer of semiconductor material having a first surface and a second surface is machined to form a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements which extend between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. A second wafer is machined separately to form a chamber delimited by a bottom wall having a through opening. The second wafer is bonded to the first surface of the first wafer in such a way that the chamber overlies the actuation structure and the through opening is aligned to the suspended mirror structure. Furthermore, a third wafer is bonded to the second surface of the first wafer to form a composite wafer device. The composite wafer device is then diced to form an optical microelectromechanical device.

公开(公告)号：US20180307038A1

公开(公告)日：2018-10-25

申请号：US15955107

申请日：2018-04-17

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto CARMINATI ,  Sonia COSTANTINI ,  Marta CARMINATI

IPC: G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0833 ,  G02B26/08 ,  G02B26/0816 ,  G02B26/10 ,  G02B26/105

Abstract: An oscillating structure includes first and second torsional elastic elements that define an axis of rotation and a moving element that is interposed between the first and second torsional elastic elements. The moving element, the first torsional elastic element and the second torsional elastic element lie in a first plane and are not in direct contact with one another. A coupling structure mechanically couples the moving element, the first torsional elastic element and the second torsional elastic element together. The moving element, the first torsional elastic element and the second torsional elastic element lie in a second plane different from the first plane. Oscillation of the moving element occurs as a result of a twisting of the first and second torsional elastic elements.

公开(公告)号：US20240043263A1

公开(公告)日：2024-02-08

申请号：US18244479

申请日：2023-09-11

Applicant: STMicroelectronics S.r.l.

Inventor： Luca SEGHIZZI ,  Nicolo' BONI ,  Laura OGGIONI ,  Roberto CARMINATI ,  Marta CARMINATI

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/0069 ,  B81C2201/013 ,  B81C2201/0156

Abstract: A method for manufacturing an optical microelectromechanical device, includes forming, in a first wafer of semiconductor material having a first surface and a second surface, a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements extending between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. The method continues with forming, in a second wafer, a chamber delimited by a bottom wall having a through opening, and bonding the second wafer to the first surface of the first wafer and bonding a third wafer to the second surface of the first wafer so that the chamber overlies the actuation structure, and the through opening is aligned to the suspended mirror structure, thus forming a device composite wafer. The device composite wafer is diced to form an optical microelectromechanical device.

公开(公告)号：US20190121122A1

公开(公告)日：2019-04-25

申请号：US16225881

申请日：2018-12-19

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia COSTANTINI ,  Marta CARMINATI ,  Daniela Angela Luisa GATTI ,  Laura Maria CASTOLDI ,  Roberto CARMINATI

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10 ,  B81C1/00

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

公开(公告)号：US20160121607A1

公开(公告)日：2016-05-05

申请号：US14531830

申请日：2014-11-03

Applicant: STMicroelectronics S.r.l.

Inventor： Dino FARALLI ,  Laura Maria CASTOLDI ,  Paolo FERRARI ,  Marta CARMINATI

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/1433 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643

Abstract: Embodiments disclose herein are directed to a microfluidic delivery device that has a predominantly semiconductor structure, such as silicon. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses silicon based materials to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.

Abstract translation: 本文公开的实施方案涉及具有主要半导体结构（例如硅）的微流体递送装置。 特别地，用于输送流体的结构可以由也称为多晶硅的多晶硅或外延硅形成。 主要使用硅基材料以形成与分配的流体接触的结构的微流体递送装置导致与广泛流体和应用相容的装置。