公开(公告)号：US20240019688A1

公开(公告)日：2024-01-18

申请号：US18220554

申请日：2023-07-11

Applicant: STMicroelectronics S.r.l.

Inventor： Massimiliano MERLI ,  Roberto CARMINATI ,  Nicolo' BONI ,  Sonia COSTANTINI ,  Carlo Luigi PRELINI

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00

CPC classification number: G02B26/0858 ,  B81B3/007 ,  B81C1/00658 ,  B81B2201/042

Abstract: Disclosed herein is a micro-electro-mechanical mirror device having a fixed structure defining an external frame delimiting a cavity, a tiltable structure extending into the cavity, a reflecting surface carried by the tiltable structure and having a main extension in a horizontal plane, and an actuation structure coupled between the tiltable structure and the fixed structure. The actuation structure is formed by a first pair of actuation arms causing rotation of the tiltable structure around a first axis parallel to the horizontal plane. The actuation arms are elastically coupled to the tiltable structure through elastic coupling elements and are each formed by a bearing structure and a piezoelectric structure. The bearing structure of each actuation arm is formed by a soft region of a first material and the elastic coupling elements are formed by a bearing layer of a second material, the second material having greater stiffness than the first material.

公开(公告)号：US20200079645A1

公开(公告)日：2020-03-12

申请号：US16565803

申请日：2019-09-10

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia COSTANTINI ,  Davide ASSANELLI ,  Aldo Luigi BORTOLOTTI ,  Michele VIMERCATI ,  Igor VARISCO

IPC: B81C1/00 ,  G02B26/08 ,  B81B7/02 ,  H04N9/31 ,  B81B7/00

Abstract: A bottom semiconductor region is formed to include a main sub-region, extending through a bottom dielectric region that coats a semiconductor wafer, and a secondary sub-region which coats the bottom dielectric region and surrounds the main sub-region. First and second top cavities are formed through the wafer, delimiting a fixed body and a patterned structure that includes a central portion which contacts the main sub-region, and deformable portions in contact with the bottom dielectric region. A bottom cavity is formed through the bottom semiconductor region, as far as the bottom dielectric region, the bottom cavity laterally delimiting a stiffening region including the main sub-region and leaving exposed parts of the bottom dielectric region that contact the deformable portions and parts of the bottom dielectric region that delimit the first and second top cavities. The parts left exposed by the bottom cavity are selectively removed.

公开(公告)号：US20180307038A1

公开(公告)日：2018-10-25

申请号：US15955107

申请日：2018-04-17

Applicant: STMicroelectronics S.r.l.

Inventor： Roberto CARMINATI ,  Sonia COSTANTINI ,  Marta CARMINATI

IPC: G02B26/08 ,  G02B26/10

CPC classification number: G02B26/0833 ,  G02B26/08 ,  G02B26/0816 ,  G02B26/10 ,  G02B26/105

Abstract: An oscillating structure includes first and second torsional elastic elements that define an axis of rotation and a moving element that is interposed between the first and second torsional elastic elements. The moving element, the first torsional elastic element and the second torsional elastic element lie in a first plane and are not in direct contact with one another. A coupling structure mechanically couples the moving element, the first torsional elastic element and the second torsional elastic element together. The moving element, the first torsional elastic element and the second torsional elastic element lie in a second plane different from the first plane. Oscillation of the moving element occurs as a result of a twisting of the first and second torsional elastic elements.

公开(公告)号：US20230324678A1

公开(公告)日：2023-10-12

申请号：US18206363

申请日：2023-06-06

Applicant: STMicroelectronics S.r.l.

Inventor： Giorgio ALLEGATO ,  Sonia COSTANTINI ,  Federico VERCESI ,  Roberto CARMINATI

IPC: G02B26/10 ,  B81C1/00 ,  G02B26/08

CPC classification number: G02B26/105 ,  B81C1/00317 ,  G02B26/0833 ,  B81C2203/0109 ,  B81B2201/042 ,  B81C2203/019 ,  B81C1/00523

Abstract: A method of making a MEMS device including forming a mirror stack on a handle layer, applying a first bonding layer to the mirror stack, and disposing a substrate on the first bonding layer. The handle layer is removed and a second bonding layer is applied. A cap layer is disposed on the second bonding layer. The mirror stack is formed by disposing a silicon layer on the handle layer, disposing a first insulating layer on the silicon layer, etching portions of the first insulating layer, and depositing a first conductive layer on the first insulating layer. The formation also includes depositing a second insulating layer on the first conductive layer, a portion of the second insulating layer to expose a portion of the first conductive layer exposed, and forming a conductive pad on the exposed portion of the first conductive layer.

公开(公告)号：US20190121122A1

公开(公告)日：2019-04-25

申请号：US16225881

申请日：2018-12-19

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia COSTANTINI ,  Marta CARMINATI ,  Daniela Angela Luisa GATTI ,  Laura Maria CASTOLDI ,  Roberto CARMINATI

IPC: G02B26/08 ,  B81B3/00 ,  G02B26/10 ,  B81C1/00

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

公开(公告)号：US20200033591A1

公开(公告)日：2020-01-30

申请号：US16591854

申请日：2019-10-03

Applicant: STMicroelectronics S.r.l.

Inventor： Giorgio ALLEGATO ,  Sonia COSTANTINI ,  Federico VERCESI ,  Roberto CARMINATI

IPC: G02B26/10 ,  B81C1/00 ,  G02B26/08

Abstract: A method for making a micro-electro mechanical (MEMS) device includes forming a MEMS mirror stack on a handle layer, and applying a first bonding layer to the MEMS mirror stack. The method continues with disposing a substrate on the first bonding layer such that the MEMS mirror stack is mechanically anchored to the substrate and so as to seal against ingress of environmental contaminants, removing the handle layer, and applying a second bonding layer to the MEMS mirror stack. A cap layer is disposed on the second bonding layer such that the cap layer is mechanically anchored to the MEMS mirror stack and so as to seal against ingress of environmental contaminants.