METHOD FOR PRODUCING DEPOSITION MASK, DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR DEVICE

    公开(公告)号:US20220098720A1

    公开(公告)日:2022-03-31

    申请号:US17550010

    申请日:2021-12-14

    IPC分类号: C23C14/04 H01L51/56 H01L51/00

    摘要: A method for manufacturing a vapor deposition mask including a resin layer, and a magnetic metal body formed on the resin layer, the method including the steps of: (A) providing a magnetic metal body having at least one first opening; (B) providing a substrate; (C) forming a resin layer by applying a solution including a resin material or a varnish of a resin material on a surface of a substrate, and then performing a heat treatment thereon; (D) securing the resin layer formed on the substrate on the magnetic metal body so as to cover the at least one first opening; (E) forming a plurality of second openings in a region of the resin layer that is located in the at least one first opening of the magnetic metal body; and (F) after the step (E), removing the substrate from the resin layer.

    METHOD FOR PRODUCING DEPOSITION MASK, DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR DEVICE

    公开(公告)号:US20190211436A1

    公开(公告)日:2019-07-11

    申请号:US16315327

    申请日:2017-01-31

    IPC分类号: C23C14/04 H01L51/00 H01L51/56

    摘要: A method for manufacturing a vapor deposition mask (100) including a resin layer (10), and a magnetic metal body (20) formed on the resin layer (10), the method including the steps of: (A) providing a magnetic metal body (20) having at least one first opening (25); (B) providing a substrate (60); (C) forming a resin layer (10) by applying a solution including a resin material or a varnish of a resin material on a surface of a substrate (60), and then performing a heat treatment thereon; (D) securing the resin layer (10) formed on the substrate (60) on the magnetic metal body (20) so as to cover the at least one first opening (25); (E) forming a plurality of second openings (13) in a region of the resin layer (10) that is located in the at least one first opening (25) of the magnetic metal body (20); and (F) after the step (E), removing the substrate (60) from the resin layer (10).

    METHOD FOR PRODUCING DEPOSITION MASK
    3.
    发明申请

    公开(公告)号:US20200020862A1

    公开(公告)日:2020-01-16

    申请号:US16548369

    申请日:2019-08-22

    摘要: A mask substrate includes a resin layer. A step of forming openings in a mask substrate includes step A of forming openings of “a” number of continual columns included in a first region (R1) including at least the (n/2)th column or the {(n+1)/2}th column; step B of forming openings of “b” number of continual columns included in a second region (R2) adjacent to the first region (R1) in a −x direction with a first gap region (RS1) being sandwiched between the first and second regions, the first gap region including “sa” number of continual columns; and step C of forming openings of “c” number of continual columns included in a third region (R3) adjacent to the first region (R1) in an x direction with a second gap region (RS2) being sandwiched between the first and third regions, the second gap region including “sb” number of continual columns.

    VAPOR DEPOSITION APPARATUS, VAPOR DEPOSITION METHOD AND METHOD OF MANUFACTURING ORGANIC EL DISPLAY APPARATUS

    公开(公告)号:US20190249289A1

    公开(公告)日:2019-08-15

    申请号:US15757420

    申请日:2017-08-21

    摘要: A vapor deposition apparatus disclosed by an embodiment comprises: a vacuum chamber (8); a mask holder (15) for holding a deposition mask 1; a substrate holder (29) for holding a substrate for vapor deposition (2); an electromagnet (3) disposed above a surface; a vapor deposition source 5 for vaporizing or sublimating a vapor deposition material; and a heat pipe (7) including at least a heat absorption part (71) and a heat dissipation part (72), the heat absorption part being in contact with the electromagnet (3), and the heat dissipation part being derived to an outside of the vacuum chamber (8). The heat pipe (7) and the electromagnet (3) are in intimate contact with each other at an area of a contact part between the heat pipe (7) and the electromagnet (3), the area being equal to or more than a cross-sectional area within an inner perimeter of a coil (32).