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公开(公告)号:US20240030123A1
公开(公告)日:2024-01-25
申请号:US18321103
申请日:2023-05-22
Applicant: Samsung Display Co., Ltd.
Inventor: KYUNG-MOK LEE , DONG-YOUB LEE
IPC: H01L23/498 , H01L23/00 , G01R27/20
CPC classification number: H01L23/49838 , H01L24/06 , H01L24/32 , H01L24/05 , H01L24/33 , G01R27/205 , H01L23/5387
Abstract: An electronic apparatus includes an electronic panel including a first pad part and a second pad part having a portion electrically connected to the first pad part, a driving circuit including a bump part overlapping the first pad part in a plan view, and a circuit board including a lead part overlapping the second pad part in a plan view. The lead part including a plurality of test leads includes a first test lead group electrically connected to the first pad part, and a second test lead group insulated from the first pad part, and one test lead of the first test lead group and one test lead of the second test lead group are electrically connected to each other.
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公开(公告)号:US20240260192A1
公开(公告)日:2024-08-01
申请号:US18517388
申请日:2023-11-22
Applicant: Samsung Display Co., LTD.
Inventor: KYUNG-MOK LEE , YOUNGMIN CHO , DONG-YOUB LEE
IPC: H05K1/18
CPC classification number: H05K1/18 , H05K2201/09027 , H05K2201/09063 , H05K2201/09072 , H05K2201/10037 , H05K2201/10128 , H05K2201/10537
Abstract: A display device includes a display panel and a circuit board. The display panel includes a display region and a bonding region. A plurality of pixels is disposed in the display region. The bonding region is spaced apart from the display region in a first direction. A plurality of pad electrodes is disposed in the bonding region. The circuit board is disposed on the display panel. The circuit board includes a first portion overlapping the display panel between the display region and the bonding region in a plan view. Accordingly, a dead space of the display device may be reduced, and a region in which a battery or the like is disposed in the display device may be secured by reducing an area in which the circuit board is disposed after the display panel is bent.
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公开(公告)号:US20230225162A1
公开(公告)日:2023-07-13
申请号:US18075735
申请日:2022-12-06
Applicant: Samsung Display Co., LTD.
Inventor: KYUNG-MOK LEE , Young Min CHO , HYUNWOO LEE
IPC: H10K59/131
CPC classification number: H01L27/3276
Abstract: A display device includes a display area and a non-display area including a first driving pad portion at which a display panel is connected to an integrated circuit chip by a solder bump having a width. The first driving pad portion includes a first pad through which an electrical signal transmits between the first driving pad portion and the integrated circuit chip, and a second pad by which alignment between the first driving pad portion and the integrated circuit chip is determined. The second pad of the first driving pad portion includes a (2-1)-th pad having a width which is the same as the width of the solder bump and a (2-2)-th pad having a width which is larger than the width of the (2-1)-th pad.
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公开(公告)号:US20230223351A1
公开(公告)日:2023-07-13
申请号:US18082538
申请日:2022-12-15
Applicant: Samsung Display Co., LTD.
Inventor: KYUNG-MOK LEE , HYUNWOO LEE , DONG-YOUB LEE , Young Min CHO
IPC: H01L23/544
CPC classification number: H01L23/544 , H01L2223/54426
Abstract: A display device includes a display panel including a non-display area in which a panel pad is disposed, and a pad portion which contacts the non-display area of the display panel, where the pad portion includes an alignment mark overlapping the panel pad, the panel pad includes a first vertical portion and a second vertical portion spaced apart from each other in a first direction, a first horizontal portion connected to the first vertical portion, and a second horizontal portion connected to the second vertical portion, and the first horizontal portion and the second horizontal portion are spaced apart from each other in a second direction crossing the first direction.
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公开(公告)号:US20240138065A1
公开(公告)日:2024-04-25
申请号:US18400347
申请日:2023-12-29
Applicant: Samsung Display Co., Ltd.
Inventor: JAEJIN OH , JUNHO KWACK , DONGJIN PARK , KYUNG-MOK LEE , DONG-YOUB LEE
CPC classification number: H05K1/118 , G01R27/08 , H01L27/124 , H05K1/0268 , H05K2201/10128
Abstract: An electronic apparatus includes an electronic panel including a plurality of pads, a circuit board including a plurality of leads, and a conductive adhesive member configured to electrically connect the circuit board and the electronic panel. The plurality of pads include a plurality of pixel pads, an arrangement pad, and a resistance measurement pad disposed between the arrangement pad and the pixels pads and insulated from the pixel pads. The plurality of leads include a plurality of pixel leads, an arrangement lead, and a resistance measurement lead disposed between the pixel leads and the arrangement lead and insulated from the pixel leads. The resistance measurement lead includes a plurality of resistance measurement leads disposed between the arrangement lead and the pixel leads and electrically connected with the resistance measurement pad, and a dummy lead spaced apart from the plurality of resistance measurement leads in a plan view.
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公开(公告)号:US20240032358A1
公开(公告)日:2024-01-25
申请号:US18310594
申请日:2023-05-02
Applicant: Samsung Display Co., Ltd.
Inventor: DONG-YOUB LEE , KYUNG-MOK LEE , HEESOOK YOON
IPC: H10K59/131 , H10K71/70 , G06T7/00 , G06T7/70
CPC classification number: H10K59/131 , H10K71/70 , G06T7/0004 , G06T7/70
Abstract: A display device includes a display panel and a driving circuit chip. The driving circuit chip includes a signal bump and an alignment bump. The display panel includes a pixel disposed in a display area, a signal pad disposed in a non-display area and corresponding to the signal bump, an alignment pad disposed in the non-display area and corresponding to the alignment bump, a reference pad that is disposed in the non-display area, is spaced apart from the alignment pad, and does not overlap the driving circuit chip in a plan view, and a signal line disposed in the display area and the non-display area and electrically connecting the pixel and the signal pad.
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