SENSING PCB STRUCTURE OF BATTERY UNIT
    4.
    发明公开

    公开(公告)号:US20230411714A1

    公开(公告)日:2023-12-21

    申请号:US18070515

    申请日:2022-11-29

    Applicant: Elentec., LTD

    Inventor: Seung Tae JUNG

    Abstract: Proposed is a sensing PCB of a battery unit, the sensing PCB being coupled to the battery unit in which a plurality of cylindrical battery cells, each of which has an upper surface provided with a positive electrode and an negative electrode, are mounted, and being electrically connected to an electrode network for connecting the plurality of battery cells, and the sensing PCB including a “C”-shaped substrate part coupled to the battery unit, a plurality of electrode parts arranged on the substrate part and making contact with ends of the electrode network, a pattern part formed on the substrate part and selectively connected to the plurality of electrode parts, and an output part located on the substrate part, electrically connected to the pattern part, having a connection terminal, and outputting an electric signal for each connection section of the electrode network through the pattern part.

    METHOD OF MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC MODULE HAVING HIGH COMPONENT DENSITY, AND DEVICE

    公开(公告)号:US20230143909A1

    公开(公告)日:2023-05-11

    申请号:US17261547

    申请日:2019-03-04

    Abstract: The invention relates to the field of techniques for manufacturing electronic devices having surface-mounted components, and can be used in avionics, telecommunication, lighting technology, and other fields, and can be configured as a power source, a converter, sensors, etc. The technical result consists in improved weight and dimension characteristics, improved heat dispersion, and increased electromagnetic screening. The present electronic module comprises a printed circuit board in the form of a three-dimensional structure, faces of which are formed by flat sections of the printed circuit board, and edges of which are formed by fold lines between the sections of the printed circuit board, wherein the mounting surface of the printed circuit board faces the inside of the three-dimensional structure, and electronic components and assemblies are grouped on the mounting surface of at least two sections of the printed circuit board such that the electronic components and assemblies of one section are disposed in the empty space between the components and assemblies of another section of the printed circuit board.

Patent Agency Ranking