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公开(公告)号：US12068766B2
公开(公告)日：2024-08-20
申请号：US18075049
申请日：2022-12-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seunghwan Yoon , Dongsik Shin , Dongjoo Kim , Danbi Jeon , Jongwook Zeong , Dabin Choi , Bonmin Koo , Jonghwa Kim , Jihye Kim , Haegweon Park
IPC: H04B1/04 , H03H9/02 , H03H9/10 , H03H9/54 , H04B7/0404 , H04B7/0413
CPC classification number: H04B1/04 , H03H9/02086 , H03H9/105 , H03H9/542 , H04B7/0404 , H04B7/0413
Abstract: The present disclosure relates to an electronic device for radiating an output signal in a wireless communication system. In one embodiment, the electronic device includes: a power amplifier configure to receive an input signal; a splitter connected to the power amplifier, which a plurality of branches; a plurality of filters connected to the plurality of branches of the splitter; and a plurality of antenna elements connected to the plurality of filters. The plurality of antenna elements radiates the output signal that is a portion of the input signal received by the power amplifier.
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公开(公告)号：US20230121638A1
公开(公告)日：2023-04-20
申请号：US18086420
申请日：2022-12-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jonghwa KIM , Bonmin Koo , Dongjoo Kim , Inho Na , Danbi Jeon , Jongwook Zeong , Sewon Gwon , Seunghwan Yoon
Abstract: A filter in a wireless communication system includes: a cover; a housing; a printed circuit board (PCB); a resonance plate provided between the cover and the PCB; and a plurality of resonators provided on a single layer in the resonance plate.
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公开(公告)号：US11612087B2
公开(公告)日：2023-03-21
申请号：US15929394
申请日：2020-04-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongjoo Kim , Bonmin Koo , Jonghwa Kim , Seunghwan Yoon , Youngju Lee , Jongwook Zeong
IPC: H05K9/00
Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.
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公开(公告)号：US11387564B2
公开(公告)日：2022-07-12
申请号：US16747887
申请日：2020-01-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongjoo Kim , Bonmin Koo , Jonghwa Kim , Seungtae Ko , Youngju Lee , Jongwook Zeong
Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A cavity filter is provided. The cavity filter includes a plate of the cavity filter and including a feeder part for supplying an electrical signal, a housing forming an exterior of the cavity filter and coupled to the plate to form a shielded space inside the cavity filter, and a metal structure having a first end coupled to an inside of the housing and a second end that extends toward the feeder part and resonates to filter frequencies in the shielded space.
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