公开(公告)号：US20230326871A1

公开(公告)日：2023-10-12

申请号：US18131258

申请日：2023-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon Kang ,  Seungwan Shin ,  Byungmin Yu ,  Junghyun Lee

IPC: H01L23/544 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  B23K26/364

CPC classification number: H01L23/544 ,  H01L25/105 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49816 ,  H01L24/48 ,  B23K26/364 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L23/3135

Abstract: A semiconductor package includes an encapsulation layer encapsulating at least one semiconductor chip, and a redistribution level layer disposed on the encapsulation layer. The redistribution level layer includes a redistribution layer and a redistribution insulating layer insulating the redistribution layer, a laser mark area is disposed on the redistribution layer and the redistribution insulating layer, and the redistribution insulating layer of the laser mark area comprises a plurality of mesh-type redistribution insulating patterns arranged apart from each other on a plane and surrounded by the redistribution layer. The redistribution level layer includes a laser mark insulating layer located on the redistribution layer and the redistribution insulating layer, wherein the laser mark insulating layer includes a laser mark exposing the redistribution layer and the mesh-type redistribution insulating patterns in the laser mark area.

公开(公告)号：US20250118574A1

公开(公告)日：2025-04-10

申请号：US18826678

申请日：2024-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeonggi Jin ,  Jinwoo Park ,  Byoungwook Jang ,  Byungmin Yu ,  Moogun Lee

IPC: H01L21/56 ,  H01L21/48 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00

Abstract: A method of manufacturing a semiconductor package includes providing a fan-out wafer on a support member, where the fan-out wafer includes a plurality of package regions and a plurality of dummy regions along an edge of the fan-out wafer, and where the plurality of package regions are divided by a cutting region, attaching the fan-out wafer to an adhesive member that is on a ring frame, forming a sealing member along the edge of the fan-out wafer and on the adhesive member to at least partially surround a plurality of dummy packages on the plurality of dummy regions, and cutting the fan-out wafer along the cutting region to separate the plurality of package regions.