公开(公告)号：US20170331209A1

公开(公告)日：2017-11-16

申请号：US15666745

申请日：2017-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Che-heung KIM ,  Chang-sik KIM ,  Seong-woon BOOH

IPC: H01R12/70 ,  H01L25/07 ,  H02M7/00

CPC classification number: H01R12/7088 ,  H01L25/072 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H01L2924/00

Abstract: According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate.