公开(公告)号：US09583463B2

公开(公告)日：2017-02-28

申请号：US14727885

申请日：2015-06-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seon-Sik Kim ,  Changwoo Koo ,  Wooseop Kim ,  Jungjoon Lee ,  Dongmin Jang

IPC: H05K7/10 ,  H05K7/12 ,  H01L25/065 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L25/0655 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10022 ,  H05K2201/10159 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor module includes: a module board, a plurality of chips mounted on the module board, and a plurality of array resistors mounted on the module board, the plurality of array resistors including at least a first array resistor. The first array resistor may include a substrate comprising a top surface, a bottom surface opposite the top surface, and first to fourth side surfaces connecting the top surface to the bottom surface, the first and third side surfaces being opposite each other, and the second and fourth side surfaces being opposite each other; a plurality of first electrodes disposed on the first side surface of the substrate, each first electrode including at least a first portion on the first side surface of the substrate and a second portion on the bottom surface of the substrate; a plurality of second electrodes disposed on the third side surface of the substrate, each second electrode opposite a respective first electrode and including at least a first portion on the third side surface of the substrate and a second portion on the bottom surface of the substrate; for each pair of respective first and second electrodes opposite each other, a resistor disposed on the substrate between the respective first and second electrodes; and at least one third electrode disposed on the second side surface of the substrate, the third electrode including at least a first portion on the second side surface of the substrate and a second portion on the bottom surface of the substrate. Each of the first electrodes, the second electrodes, and the third electrode may be bonded to the module board.

Abstract translation: 半导体模块包括：模块板，安装在模块板上的多个芯片，以及安装在模块板上的多个阵列电阻器，所述多个阵列电阻器至少包括第一阵列电阻器。 第一阵列电阻器可以包括基板，其包括顶表面，与顶表面相对的底表面，以及将顶表面连接到底表面的第一至第四侧表面，第一和第三侧表面彼此相对，第二 和第四侧面彼此相对; 多个第一电极，设置在所述基板的第一侧表面上，每个第一电极至少包括在所述基板的第一侧表面上的第一部分和所述基板的底表面上的第二部分; 多个第二电极，设置在所述基板的第三侧表面上，每个第二电极与相应的第一电极相对，并且至少包括在所述基板的第三侧表面上的第一部分和所述基板的底表面上的第二部分; 对于彼此相对的每对相应的第一和第二电极，设置在相应的第一和第二电极之间的基板上的电阻器; 以及设置在所述基板的所述第二侧表面上的至少一个第三电极，所述第三电极至少包括所述基板的第二侧表面上的第一部分和所述基板的底表面上的第二部分。 第一电极，第二电极和第三电极中的每一个可以结合到模块板。