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Patent Agency Ranking
公开(公告)号：US10952327B2
公开(公告)日：2021-03-16
申请号：US16254907
申请日：2019-01-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae-Seok Jang , Dongmin Jang , Geunje Park , Jaekwang Lee
Abstract: A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.
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公开(公告)号：US09583463B2
公开(公告)日：2017-02-28
申请号：US14727885
申请日：2015-06-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seon-Sik Kim , Changwoo Koo , Wooseop Kim , Jungjoon Lee , Dongmin Jang
IPC: H05K7/10 , H05K7/12 , H01L25/065 , H05K1/11 , H05K3/34
CPC classification number: H01L25/0655 , H01L25/16 , H01L2924/0002 , H05K1/111 , H05K3/3442 , H05K2201/09381 , H05K2201/10022 , H05K2201/10159 , Y02P70/611 , Y02P70/613 , H01L2924/00
Abstract: A semiconductor module includes: a module board, a plurality of chips mounted on the module board, and a plurality of array resistors mounted on the module board, the plurality of array resistors including at least a first array resistor. The first array resistor may include a substrate comprising a top surface, a bottom surface opposite the top surface, and first to fourth side surfaces connecting the top surface to the bottom surface, the first and third side surfaces being opposite each other, and the second and fourth side surfaces being opposite each other; a plurality of first electrodes disposed on the first side surface of the substrate, each first electrode including at least a first portion on the first side surface of the substrate and a second portion on the bottom surface of the substrate; a plurality of second electrodes disposed on the third side surface of the substrate, each second electrode opposite a respective first electrode and including at least a first portion on the third side surface of the substrate and a second portion on the bottom surface of the substrate; for each pair of respective first and second electrodes opposite each other, a resistor disposed on the substrate between the respective first and second electrodes; and at least one third electrode disposed on the second side surface of the substrate, the third electrode including at least a first portion on the second side surface of the substrate and a second portion on the bottom surface of the substrate. Each of the first electrodes, the second electrodes, and the third electrode may be bonded to the module board.
Abstract translation: 半导体模块包括：模块板，安装在模块板上的多个芯片，以及安装在模块板上的多个阵列电阻器，所述多个阵列电阻器至少包括第一阵列电阻器。 第一阵列电阻器可以包括基板，其包括顶表面，与顶表面相对的底表面，以及将顶表面连接到底表面的第一至第四侧表面，第一和第三侧表面彼此相对，第二 和第四侧面彼此相对; 多个第一电极，设置在所述基板的第一侧表面上，每个第一电极至少包括在所述基板的第一侧表面上的第一部分和所述基板的底表面上的第二部分; 多个第二电极，设置在所述基板的第三侧表面上，每个第二电极与相应的第一电极相对，并且至少包括在所述基板的第三侧表面上的第一部分和所述基板的底表面上的第二部分; 对于彼此相对的每对相应的第一和第二电极，设置在相应的第一和第二电极之间的基板上的电阻器; 以及设置在所述基板的所述第二侧表面上的至少一个第三电极，所述第三电极至少包括所述基板的第二侧表面上的第一部分和所述基板的底表面上的第二部分。 第一电极，第二电极和第三电极中的每一个可以结合到模块板。
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公开(公告)号：US11758652B2
公开(公告)日：2023-09-12
申请号：US17360417
申请日：2021-06-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dongyoon Seo , Geunje Park , Dohyung Kim , Hwanwook Park , Dongmin Jang , Jaeseok Jang
CPC classification number: H05K1/111 , H05K1/181 , H05K2201/09745
Abstract: A printed circuit board (PCB) includes: an insulation substrate; a first pad on the insulation substrate; and a second pad on the insulation substrate and spaced apart from the first pad, wherein the second pad has a size substantially the same as a size of the first pad, wherein the first pad includes a first recess configured to receive a first electrode of a passive element, wherein the second pad includes a second recess receiving a second electrode of the passive element, wherein the first recess has a depth substantially the same as a thickness of the first pad, wherein the second recess has a depth substantially the same as a thickness of the second pad, wherein each of the first recess and the second recess exposes an upper surface of the insulation substrate.
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公开(公告)号：US11523506B2
公开(公告)日：2022-12-06
申请号：US17345815
申请日：2021-06-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jaekwang Lee , Dongmin Jang , Hwanwook Park , Jaeseok Jang , Dohyung Kim
Abstract: A module board is provided. The module board includes a plurality of first left terminals and a plurality of first right terminals. Each of the plurality of first left terminals includes a left upper body, a left lower body, and a left lower bar which are connected to one another and sequentially provided, each of the plurality of first right terminals includes a right upper body, a right lower body, and a right lower bar which are connected to one another and sequentially provided, and a first width of each of the left upper body and the right upper body is greater than a second width of each of the left lower bar and the right lower bar.
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公开(公告)号：US20190335586A1
公开(公告)日：2019-10-31
申请号：US16254907
申请日：2019-01-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： JAE-SEOK JANG , Dongmin Jang , Geunje Park , Jaekwang Lee
IPC: H05K1/18
Abstract: A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.
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