公开(公告)号：US08724400B2

公开(公告)日：2014-05-13

申请号：US13948138

申请日：2013-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwang-Jin Lee ,  Chang-Soo Lee ,  Joon-Min Park ,  Hui-Kwon Seo ,  Qi Wang

IPC: G11C16/04

CPC classification number: G11C13/0097 ,  G11C13/0004 ,  G11C13/0069 ,  G11C2013/0088 ,  G11C2211/5646

Abstract: A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different.

Abstract translation: 存储器件包括存储单元阵列，该存储单元阵列包括多个存储器块，每个存储器块包括多个存储器单元，耦合到多个存储器单元中的行的多个字线，耦合到多个存储器单元的列的多个位线 多个存储单元，以及控制擦除操作的控制单元，使得擦除数据被同时写入与擦除单元对应的多个存储单元中。 第一擦除模式可以包括第一擦除单元和第一擦除数据模式。 第二擦除模式可以包括第二擦除单元和第二擦除模式。 第一和第二擦除单元以及第一和第二擦除数据模式中的至少一个是不同的。

公开(公告)号：US11037042B2

公开(公告)日：2021-06-15

申请号：US16599160

申请日：2019-10-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hui-Kwon Seo

IPC: G06K19/077 ,  H04M15/00

Abstract: A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.

公开(公告)号：US10445024B2

公开(公告)日：2019-10-15

申请号：US15793469

申请日：2017-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hui-Kwon Seo

IPC: G06F3/06 ,  H01L27/02 ,  H01L23/498 ,  H04B1/401 ,  H01L23/50 ,  H01L27/11526 ,  H04B1/3816

Abstract: A semiconductor integrated card includes an external package, a subscriber identification module (SIM) circuit, a plurality of SIM pins, a storage device and a plurality of memory pins. The SIM circuit is formed inside of the external package and is configured to store subscriber information. The SIM pins are formed on a surface of the external package and are electrically connected to the SIM circuit. The storage device is formed inside of the external package and is separated from the SIM circuit. The storage device includes a nonvolatile memory device. The memory pins are formed on the surface of the external package and are electrically connected to the storage device.