公开(公告)号：US20250027875A1

公开(公告)日：2025-01-23

申请号：US18775796

申请日：2024-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinwoo Lee ,  Seungryeol Oh ,  Hidong Kwak ,  Jeongho Ahn ,  Seongsil Lee ,  Suyoung Lee ,  Hyeongcheol Lee

IPC: G01N21/31

Abstract: An optical imaging device includes a pulse generator including a pulse generating device configured to generate pulse lasers and a pulse expander configured to receive a pulse laser from the pulse generating device, and generate a broadened pulse laser by expanding a spectrum and width of the received pulse laser, an optical assembly including an objective lens configured to receive the broadened pulse laser and pass the received broadened pulse laser to a target object, and a light receiver including a light receiving device configured to receive a reflected pulse laser corresponding to the broadened pulse laser reflected from the target object and convert the reflected pulse laser into an electrical signal, and at least one processor configured to generate a spectral image set based on the electrical signal generated by the light receiving device.

公开(公告)号：US20240412943A1

公开(公告)日：2024-12-12

申请号：US18528851

申请日：2023-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwoo Lee ,  Bumjoo Lee ,  Jong Cheon Sun ,  Suyoung Lee ,  Hyeongcheol Lee

IPC: H01J37/26 ,  H01J37/28

Abstract: A substrate inspection method includes reducing a surface potential of a substrate; and increasing a difference of the surface potential of the substrate, where reducing the surface potential of the substrate includes: controlling a scanning electron microscope to irradiate an electron beam to the substrate for a first irradiation time; and after a first standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the first irradiation time, where increasing the difference of the surface potential of the substrate includes: controlling the scanning electron microscope to irradiate the electron beam to the substrate for a second irradiation time; and after a second standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the second irradiation time, and where the first irradiation time is less than the second irradiation time.