OPTICAL IMAGING DEVICE
    1.
    发明申请

    公开(公告)号:US20250027875A1

    公开(公告)日:2025-01-23

    申请号:US18775796

    申请日:2024-07-17

    Abstract: An optical imaging device includes a pulse generator including a pulse generating device configured to generate pulse lasers and a pulse expander configured to receive a pulse laser from the pulse generating device, and generate a broadened pulse laser by expanding a spectrum and width of the received pulse laser, an optical assembly including an objective lens configured to receive the broadened pulse laser and pass the received broadened pulse laser to a target object, and a light receiver including a light receiving device configured to receive a reflected pulse laser corresponding to the broadened pulse laser reflected from the target object and convert the reflected pulse laser into an electrical signal, and at least one processor configured to generate a spectral image set based on the electrical signal generated by the light receiving device.

    Image processing device for noise reduction using dual conversion gain and operation method thereof

    公开(公告)号:US11722795B2

    公开(公告)日:2023-08-08

    申请号:US17670793

    申请日:2022-02-14

    CPC classification number: H04N25/59 H04N25/587 H04N25/60

    Abstract: Disclosed is a device for noise reduction using dual conversion gain, which includes an image sensor including a pixel array, the pixel array configured to generate a first pixel signal corresponding to a first conversion gain and a second pixel signal corresponding to a second conversion gain from pixels sharing a floating diffusion region and the image sensor configured to generate first image data and second image data based on the first pixel signal and the second pixel signal, and an image signal processor that generates an output image based on the first image data and the second image data. The image signal processor includes a normalization circuit that normalizes the first image data based on a dynamic range of the second image data to generate third image data, and a blending circuit that generates the output image based on the second image data and the third image data.

    SUBSTRATE INSPECTION METHOD
    7.
    发明申请

    公开(公告)号:US20240412943A1

    公开(公告)日:2024-12-12

    申请号:US18528851

    申请日:2023-12-05

    Abstract: A substrate inspection method includes reducing a surface potential of a substrate; and increasing a difference of the surface potential of the substrate, where reducing the surface potential of the substrate includes: controlling a scanning electron microscope to irradiate an electron beam to the substrate for a first irradiation time; and after a first standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the first irradiation time, where increasing the difference of the surface potential of the substrate includes: controlling the scanning electron microscope to irradiate the electron beam to the substrate for a second irradiation time; and after a second standby time has elapsed, controlling the scanning electron microscope to re-irradiate the electron beam to the substrate for the second irradiation time, and where the first irradiation time is less than the second irradiation time.

    INSPECTION APPARATUS FOR INSPECTING SEMICONDUCTOR DEVICES USING CHARGED PARTICLES

    公开(公告)号:US20210333225A1

    公开(公告)日:2021-10-28

    申请号:US17175173

    申请日:2021-02-12

    Abstract: An inspection apparatus and a method of inspecting a semiconductor device are disclosed. The inspection apparatus includes a stage on which a semiconductor device is positioned, a first light source irradiating a high-frequency light onto an inspection area of the semiconductor device to reduce a potential barrier of a PN junction in the semiconductor device, a beam scanner arranged over the semiconductor device and irradiating a charged particle beam onto the inspection area of the semiconductor device to generate secondary electrons, and a defect detector generating a detection image corresponding to the inspection area and detecting, based on a voltage contrast between a reference image and a plurality of detection images, a defect image indicating a defect in the semiconductor device from among the plurality of detection images.

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