公开(公告)号：US20170200658A1

公开(公告)日：2017-07-13

申请号：US15366964

申请日：2016-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yusin Yang ,  Kang-Woong Ko ,  Sung Yoon Ryu ,  Gil-Woo Song ,  Sangkil Lee ,  Chungsam Jun ,  HyoungJo Jeon ,  Masahiro Horie

IPC: H01L21/66 ,  G01N21/27 ,  G01N21/95

Abstract: A method of inspecting a substrate includes irradiating light onto a substrate that has experienced a first process, obtaining spectral data of the light reflected from the substrate, detecting a defect region of the substrate from the spectral data, and extracting a first defect site that occurred in or during the first process from the defect region. Extracting the first defect site includes establishing an effective area where the first process affects the substrate, and extracting a superimposed area that is overlapped with the effective area from the defect region. The superimposed area is defined as the first defect site.