公开(公告)号：US20150070690A1

公开(公告)日：2015-03-12

申请号：US14316173

申请日：2014-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Ho Rim ,  Yu-Sin Yang ,  Sang-Kil Lee ,  Yong-Deok Jeong ,  Hyung-Suk Cho

IPC: G01N21/88

CPC classification number: G01N21/956 ,  G01N21/9501 ,  G01N2021/8835

Abstract: In a method of detecting a defect of a substrate, a first light having a first intensity may be irradiated to a first region of the substrate through a first aperture. A defect in the first region may be detected using a first reflected light from the first region. A second light having a second intensity may be irradiated to a second region of the substrate through a second aperture. A defect in the second region may be detected using a second reflected light from the second region. Thus, the defects by the regions of the substrate may be accurately detected.

Abstract translation: 在检测衬底的缺陷的方法中，具有第一强度的第一光可以通过第一孔照射到衬底的第一区域。 可以使用来自第一区域的第一反射光检测第一区域中的缺陷。 具有第二强度的第二光可以通过第二孔照射到衬底的第二区域。 可以使用来自第二区域的第二反射光检测第二区域中的缺陷。 因此，可以精确地检测由基板的区域的缺陷。

公开(公告)号：US20170076435A1

公开(公告)日：2017-03-16

申请号：US15177938

申请日：2016-06-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-Suk PARK ,  Hyung-Suk Cho

IPC: G06T7/00

CPC classification number: H01L22/12 ,  G01N21/9501

Abstract: The defect imaging apparatus including a chamber having a stage to which a substrate having at least one process defect and at least one reference defects defined at a given area is secured, a position controller configured to obtain an imaging error from a detected actual position and a conversion position of the reference defect and correct a conversion position of the process defect by the imaging error, and generate an irradiation position corresponding to an actual position of the process defect, an image signal generator configured to generate an image signal of the process defect by irradiating an electron beam to the irradiation position and detecting charged particles from the irradiation position in response to the irradiated electron beam, and an imaging device configured to generate a defect image of the process defect by processing the generated image signal may be provided.

Abstract translation: 所述缺陷成像装置包括具有阶段的腔室，所述阶段确保具有至少一个处理缺陷和至少一个在给定区域上限定的参考缺陷的基板;位置控制器，被配置为从检测到的实际位置获得成像误差;以及 参考缺陷的转换位置，并通过成像误差校正处理缺陷的转换位置，并且生成与处理缺陷的实际位置相对应的照射位置，图像信号发生器被配置为通过以下步骤生成处理缺陷的图像信号 照射电子束到照射位置并响应于照射的电子束检测来自照射位置的带电粒子，以及被配置为通过处理所生成的图像信号来产生处理缺陷的缺陷图像的成像装置。

公开(公告)号：US09831137B2

公开(公告)日：2017-11-28

申请号：US15177938

申请日：2016-06-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-Suk Park ,  Hyung-Suk Cho

IPC: G06T7/00 ,  H01L21/66 ,  G01N21/95

CPC classification number: H01L22/12 ,  G01N21/9501

Abstract: The defect imaging apparatus including a chamber having a stage to which a substrate having at least one process defect and at least one reference defects defined at a given area is secured, a position controller configured to obtain an imaging error from a detected actual position and a conversion position of the reference defect and correct a conversion position of the process defect by the imaging error, and generate an irradiation position corresponding to an actual position of the process defect, an image signal generator configured to generate an image signal of the process defect by irradiating an electron beam to the irradiation position and detecting charged particles from the irradiation position in response to the irradiated electron beam, and an imaging device configured to generate a defect image of the process defect by processing the generated image signal may be provided.

公开(公告)号：US09194816B2

公开(公告)日：2015-11-24

申请号：US14316173

申请日：2014-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min-Ho Rim ,  Yu-Sin Yang ,  Sang-Kil Lee ,  Yong-Deok Jeong ,  Hyung-Suk Cho

IPC: G01N21/00 ,  G01N21/956 ,  G01N21/95 ,  G01N21/88

CPC classification number: G01N21/956 ,  G01N21/9501 ,  G01N2021/8835

Abstract: In a method of detecting a defect of a substrate, a first light having a first intensity may be irradiated to a first region of the substrate through a first aperture. A defect in the first region may be detected using a first reflected light from the first region. A second light having a second intensity may be irradiated to a second region of the substrate through a second aperture. A defect in the second region may be detected using a second reflected light from the second region. Thus, the defects by the regions of the substrate may be accurately detected.

Abstract translation: 在检测衬底的缺陷的方法中，具有第一强度的第一光可以通过第一孔照射到衬底的第一区域。 可以使用来自第一区域的第一反射光检测第一区域中的缺陷。 具有第二强度的第二光可以通过第二孔照射到衬底的第二区域。 可以使用来自第二区域的第二反射光检测第二区域中的缺陷。 因此，可以精确地检测由基板的区域的缺陷。