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    Method of Detecting a Defect of a Substrate and Apparatus for Performing the Same
    2.
    发明申请
    Method of Detecting a Defect of a Substrate and Apparatus for Performing the Same 有权
    检测基板缺陷的方法及其执行装置

    公开(公告)号：US20150070690A1

    公开(公告)日：2015-03-12

    申请号：US14316173

    申请日：2014-06-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Ho Rim ,  Yu-Sin Yang ,  Sang-Kil Lee ,  Yong-Deok Jeong ,  Hyung-Suk Cho

    IPC: G01N21/88

    CPC classification number: G01N21/956 ,  G01N21/9501 ,  G01N2021/8835

    Abstract: In a method of detecting a defect of a substrate, a first light having a first intensity may be irradiated to a first region of the substrate through a first aperture. A defect in the first region may be detected using a first reflected light from the first region. A second light having a second intensity may be irradiated to a second region of the substrate through a second aperture. A defect in the second region may be detected using a second reflected light from the second region. Thus, the defects by the regions of the substrate may be accurately detected.

    Abstract translation: 在检测衬底的缺陷的方法中，具有第一强度的第一光可以通过第一孔照射到衬底的第一区域。 可以使用来自第一区域的第一反射光检测第一区域中的缺陷。 具有第二强度的第二光可以通过第二孔照射到衬底的第二区域。 可以使用来自第二区域的第二反射光检测第二区域中的缺陷。 因此，可以精确地检测由基板的区域的缺陷。

    Spectral ellipsometry measurement and data analysis device and related systems and methods
    7.
    发明授权
    Spectral ellipsometry measurement and data analysis device and related systems and methods 有权

    公开(公告)号：US09733178B2

    公开(公告)日：2017-08-15

    申请号：US14806775

    申请日：2015-07-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sung-Yoon Ryu ,  Woo-Seok Ko ,  Yu-Sin Yang ,  Sang-Kil Lee ,  Chung-Sam Jun

    IPC: G01N21/21 ,  G01N21/95 ,  G01N21/956

    CPC classification number: G01N21/211 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/213

    Abstract: Spectral ellipsometry measurement systems are provided including a polarizer that rotates at a first angle and adjusts a polarizing direction of incident light of a measurement sample; a compensator that rotates at a second angle, different from the first angle, and adjusts a phase difference of the incident light; an analyzer that rotates at a third angle and adjusts a polarizing direction of light reflected on the measurement sample; a detector that detects a spectral image from the reflected light; a controller that controls one of the polarizer, the compensator, and the analyzer according to polarizer-compensator-analyzer (PCA) angle sets including the first to third angles; and a processor that receives, from the detector, a first spectral image corresponding to a first PCA angle set and a first wavelength and a second spectral image corresponding to a second PCA angle set and a second wavelength, different from the first wavelength, and generates a polarizer-compensator-analyzer rotating (PCAR) spectral matrix using the first and second spectral images.

    Apparatus for measuring thickness of thin film, system including the apparatus, and method for measuring thickness of thin film
    8.
    发明授权
    Apparatus for measuring thickness of thin film, system including the apparatus, and method for measuring thickness of thin film 有权
    用于测量薄膜厚度的装置，包括该装置的系统以及用于测量薄膜厚度的方法

    公开(公告)号：US09417055B2

    公开(公告)日：2016-08-16

    申请号：US14799107

    申请日：2015-07-14

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sung-Yoon Ryu ,  Sang-Kil Lee ,  Chung-Sam Jun ,  Woo-Seok Ko ,  Ho-Jeong Kwak ,  Souk Kim ,  Kwan-Woo Ryu ,  Yu-Sin Yang

    IPC: G01B11/28 ,  G01B11/06

    CPC classification number: G01B11/0633

    Abstract: An apparatus and a system for measuring the thickness of a thin film are provided. The apparatus includes a signal detector, a Fast Fourier Transform (FFT) generator, an Inverse Fast Fourier Transform (IFFT) generator, and a thickness analyzer. The signal detector detects an electric field signal with respect to a reflected light that is reflected from a thin film. The FFT generator performs FFT with respect to the electric field signal to separate a DC component from an AC component of the electric field signal. The IFFT generator receives the separated AC component of the electric field signal, performs IFFT with respect to the AC component, and extracts a phase value of the AC component. The thickness analyzer measures the thickness of the thin film using the extracted phase value.

    Abstract translation: 提供了用于测量薄膜厚度的装置和系统。 该装置包括信号检测器，快速傅里叶变换（FFT）发生器，快速傅里叶逆变换（IFFT）发生器和厚度分析器。 信号检测器检测相对于从薄膜反射的反射光的电场信号。 FFT发生器相对于电场信号执行FFT，以将DC分量与电场信号的AC分量分离。 IFFT发生器接收电场信号的分离的AC分量，相对于AC分量执行IFFT，并提取AC分量的相位值。 厚度分析器使用提取的相位值来测量薄膜的厚度。

    Methods of fabricating microelectronic substrate inspection equipment
    9.
    发明授权
    Methods of fabricating microelectronic substrate inspection equipment 有权
    制造微电子基板检测设备的方法

    公开(公告)号：US09123503B2

    公开(公告)日：2015-09-01

    申请号：US14257048

    申请日：2014-04-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Kook Kim ,  Woo-Seok Ko ,  Yu-Sin Yang ,  Sang-Kil Lee ,  Chang-Hoon Choi

    IPC: H01J37/26 ,  H01J37/08

    CPC classification number: H01J37/265 ,  H01J37/08 ,  H01J2237/002 ,  H01J2237/006 ,  H01J2237/0807

    Abstract: Microelectronic substrate inspection equipment includes a gas container which contains helium gas, a helium ion generator which is disposed in the gas container and converts the helium gas into helium ions and a wafer stage which is disposed under the gas container and on which a substrate to be inspected is placed. The equipment further includes a secondary electron detector which is disposed above the wafer stage and detects electrons generated from the substrate, a compressor which receives first gaseous nitrogen from a continuous nitrogen supply device and compresses the received first gaseous nitrogen into liquid nitrogen, a liquid nitrogen dewar which is connected to the compressor and stores the liquid nitrogen, and a cooling device that is coupled to the helium ion generator. The cooling device is disposed on the gas container, and cools the helium ion generator by vaporizing the liquid nitrogen received from the liquid nitrogen dewar into second gaseous nitrogen. Related methods are also disclosed.

    Abstract translation: 微电子基板检查设备包括含有氦气的气体容器，设置在气体容器中并将氦气转换为氦离子的氦离子发生器和设置在气体容器下方的晶片载台， 检查被放置。 该设备还包括二次电子检测器，其设置在晶片台上方并检测从基板产生的电子;压缩机，其接收来自连续氮供应装置的第一气态氮并将接收到的第一气态氮压缩成液态氮;液氮 连接到压缩机并储存液氮的杜瓦瓶，以及耦合到氦离子发生器的冷却装置。 冷却装置设置在气体容器上，并且通过将从液氮氮气中接收的液氮蒸发成第二气态氮来冷却氦离子发生器。 还公开了相关方法。

    Inspecting apparatus based on hyperspectral imaging
    10.
    发明授权
    Inspecting apparatus based on hyperspectral imaging 有权

    公开(公告)号：US11037283B2

    公开(公告)日：2021-06-15

    申请号：US16444719

    申请日：2019-06-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sung-Ho Jang ,  Yasuhiro Hidaka ,  Young-kyu Park ,  Ye-eun Park ,  Yu-Sin Yang

    IPC: G06T7/00 ,  G02B27/09 ,  G02B5/30 ,  H04N13/239 ,  G02B26/12

    Abstract: Provided is a hyperspectral imaging (HSI)-based inspection apparatus capable of quickly and stably performing two-dimensional (2D) HSI for an inspection object, and accordingly, capable of quickly and accurately inspecting the inspection object. The HSI-based inspection apparatus includes: a stage on which an inspection object is arranged; an optical system configured to allow light to be incident on the inspection object and emit the light reflected from the inspection object; a scan mirror configured to reflect the emitted light from the optical system while rotating; and a hyperspectral camera configured to obtain an image having a wavelength direction and a line direction as two axes for light reflected from the scan mirror, wherein, by using the rotation of the scan mirror, the hyperspectral camera is configured to perform the 2D HSI for the inspection object.

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