Method and apparatus to measure step height of device using scanning electron microscope
    1.
    发明授权
    Method and apparatus to measure step height of device using scanning electron microscope 有权
    使用扫描电子显微镜测量器件的台阶高度的方法和装置

    公开(公告)号:US08759763B2

    公开(公告)日:2014-06-24

    申请号:US13680347

    申请日:2012-11-19

    Abstract: A method of measuring a step height of a device using a scanning electron microscope (SEM), the method may include providing a device which comprises a first region and a second region, wherein a step is formed between the first region and the second region, obtaining a SEM image of the device by photographing the device using a SEM, wherein the SEM image comprises a first SEM image region for the first region and a second SEM image region for the second region, converting the SEM image into a gray-level histogram and calculating a first peak value related to the first SEM image region and a second peak value related to the second SEM image region, wherein the first peak value and the second peak value are repeatedly calculated by varying a focal length of the SEM, and determining a height of the step by analyzing a trend of changes in the first peak value according to changes in the focal length and a trend of changes in the second peak value according to the changes in the focal length.

    Abstract translation: 使用扫描电子显微镜(SEM)测量器件的台阶高度的方法可以包括提供包括第一区域和第二区域的器件,其中在第一区域和第二区域之间形成台阶, 通过使用SEM拍摄该装置来获得该装置的SEM图像,其中,SEM图像包括用于第一区域的第一SEM图像区域和用于第二区域的第二SEM图像区域,将SEM图像转换为灰度级直方图 以及计算与第一SEM图像区域相关的第一峰值和与第二SEM图像区域相关的第二峰值,其中通过改变SEM的焦距来重复计算第一峰值和第二峰值,并且确定 通过根据焦距的变化分析第一峰值的变化趋势和根据焦距变化的第二峰值变化的趋势的步骤的高度 th。

    Method of detecting a defect of a substrate and apparatus for performing the same
    3.
    发明授权
    Method of detecting a defect of a substrate and apparatus for performing the same 有权
    检测基板的缺陷的方法及其执行装置

    公开(公告)号:US09194816B2

    公开(公告)日:2015-11-24

    申请号:US14316173

    申请日:2014-06-26

    CPC classification number: G01N21/956 G01N21/9501 G01N2021/8835

    Abstract: In a method of detecting a defect of a substrate, a first light having a first intensity may be irradiated to a first region of the substrate through a first aperture. A defect in the first region may be detected using a first reflected light from the first region. A second light having a second intensity may be irradiated to a second region of the substrate through a second aperture. A defect in the second region may be detected using a second reflected light from the second region. Thus, the defects by the regions of the substrate may be accurately detected.

    Abstract translation: 在检测衬底的缺陷的方法中,具有第一强度的第一光可以通过第一孔照射到衬底的第一区域。 可以使用来自第一区域的第一反射光检测第一区域中的缺陷。 具有第二强度的第二光可以通过第二孔照射到衬底的第二区域。 可以使用来自第二区域的第二反射光检测第二区域中的缺陷。 因此,可以精确地检测由基板的区域的缺陷。

    Method of Detecting a Defect of a Substrate and Apparatus for Performing the Same
    4.
    发明申请
    Method of Detecting a Defect of a Substrate and Apparatus for Performing the Same 有权
    检测基板缺陷的方法及其执行装置

    公开(公告)号:US20150070690A1

    公开(公告)日:2015-03-12

    申请号:US14316173

    申请日:2014-06-26

    CPC classification number: G01N21/956 G01N21/9501 G01N2021/8835

    Abstract: In a method of detecting a defect of a substrate, a first light having a first intensity may be irradiated to a first region of the substrate through a first aperture. A defect in the first region may be detected using a first reflected light from the first region. A second light having a second intensity may be irradiated to a second region of the substrate through a second aperture. A defect in the second region may be detected using a second reflected light from the second region. Thus, the defects by the regions of the substrate may be accurately detected.

    Abstract translation: 在检测衬底的缺陷的方法中,具有第一强度的第一光可以通过第一孔照射到衬底的第一区域。 可以使用来自第一区域的第一反射光检测第一区域中的缺陷。 具有第二强度的第二光可以通过第二孔照射到衬底的第二区域。 可以使用来自第二区域的第二反射光检测第二区域中的缺陷。 因此,可以精确地检测由基板的区域的缺陷。

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