公开(公告)号：US20210008686A1

公开(公告)日：2021-01-14

申请号：US16747034

申请日：2020-01-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yonghee LEE ,  Yungjun KIM ,  Hyunjoon PARK ,  Taemin EARMME ,  Seungchul HAN ,  Byoungho KWON ,  Kuntack LEE

IPC: B24B37/20 ,  B24B37/005

Abstract: A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.

公开(公告)号：US20240208005A1

公开(公告)日：2024-06-27

申请号：US18226873

申请日：2023-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jubong LEE ,  Jongsu KIM ,  Sungyong PARK ,  Bongki PARK ,  Eunsun PARK ,  Hyunjoon PARK ,  Hoseop CHOI

IPC: B24B53/017 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B37/005 ,  B24B37/04

Abstract: A cleaner for a CMP apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. The cleaning body may be arranged under a polishing head of the CMP apparatus configured to hold a substrate. The cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. The cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. The vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. The controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. Thus, a scratch caused by a defect may not be generated at the substrate.