公开(公告)号：US20180288908A1

公开(公告)日：2018-10-04

申请号：US15938689

申请日：2018-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hae-Jin LEE ,  Oh-Hyuck Kwon ,  Min Park ,  Jung-Je Bang ,  Jae-Deok Lim ,  Kyung-Ha Koo ,  Jae-Heung Ye ,  Chang-Tae Kim ,  Chi-Hyun Cho

IPC: H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H05K1/18

Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

公开(公告)号：US11178799B2

公开(公告)日：2021-11-16

申请号：US15938689

申请日：2018-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hae-Jin Lee ,  Oh-Hyuck Kwon ,  Min Park ,  Jung-Je Bang ,  Jae-Deok Lim ,  Kyung-Ha Koo ,  Jae-Heung Ye ,  Chang-Tae Kim ,  Chi-Hyun Cho

IPC: H05K9/00 ,  H05K7/20 ,  H05K1/02 ,  H05K1/18

Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

公开(公告)号：US10573951B2

公开(公告)日：2020-02-25

申请号：US15603582

申请日：2017-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soon Yong Lee ,  Yeon Sik Yu ,  Il Kim ,  Keon Young Seo ,  Min-Goo Seo ,  Jae-Deok Lim ,  Si Ho Jang ,  Hyun-Tae Jang

IPC: H01P7/08 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

Abstract: A split resonator and a printed circuit board (PCB) including the same are disclosed. The split resonator is mounted to one side of the PCB to improve the electromagnetic shielding effect, and absorbs a radiation field emitted to the outer wall of the PCB. The PCB includes: a substrate on which one or more electronic components are populated; a dielectric substrate mounted to one side of the substrate; one pair of conductors provided in the dielectric substrate, spaced apart from the substrate in a thickness direction of the substrate by a predetermined distance, and arranged to face each other; and a connection portion configured to interconnect the one pair of conductors, and arranged in parallel to the thickness direction of the substrate.