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公开(公告)号：US20180288908A1
公开(公告)日：2018-10-04
申请号：US15938689
申请日：2018-03-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hae-Jin LEE , Oh-Hyuck Kwon , Min Park , Jung-Je Bang , Jae-Deok Lim , Kyung-Ha Koo , Jae-Heung Ye , Chang-Tae Kim , Chi-Hyun Cho
Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.
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公开(公告)号：US11178799B2
公开(公告)日：2021-11-16
申请号：US15938689
申请日：2018-03-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hae-Jin Lee , Oh-Hyuck Kwon , Min Park , Jung-Je Bang , Jae-Deok Lim , Kyung-Ha Koo , Jae-Heung Ye , Chang-Tae Kim , Chi-Hyun Cho
Abstract: Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.
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Patent Agency Ranking
公开(公告)号：US20170202093A1
公开(公告)日：2017-07-13
申请号：US15405256
申请日：2017-01-12
Applicant: Samsung Electronics Co., Ltd
Inventor： Jung-Je Bang , Yong-Won Lee , Jeong-Ung Kim , Jae-Heung Ye
CPC classification number: H05K5/0004 , H01R4/02 , H05K1/18 , H05K5/0086 , H05K9/0007 , H05K9/0028
Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.
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公开(公告)号：US10470345B2
公开(公告)日：2019-11-05
申请号：US15377012
申请日：2016-12-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae-Heung Ye , Jung-Je Bang , Jeong-Ung Kim , Ki-Youn Jang
IPC: H05K9/00
Abstract: Disclosed are various embodiments relating to an electronic device that includes a shield structure. According to an example embodiment, the electronic device may include: a housing that includes a first surface directed in a first direction and a second surface directed in a second direction that is opposite to the first direction; a printed circuit board included in the housing, wherein the printed circuit board includes a first surface directed in the first direction and a second surface directed in the second direction; at least one electronic component disposed on the first surface of the printed circuit board; and at least one shield structure configured to electro-magnetically shield the at least one electronic component, and the shield structure may include: a flexible sheet that includes a first sheet that covers the at least one electronic component and a second sheet that at least partially covers the space between the first sheet and the first surface of the printed circuit board, when viewed from above the first surface of the printed circuit board; and at least one frame structure that supports the first and second sheets.
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公开(公告)号：US09888586B2
公开(公告)日：2018-02-06
申请号：US15405256
申请日：2017-01-12
Applicant: Samsung Electronics Co., Ltd
Inventor： Jung-Je Bang , Yong-Won Lee , Jeong-Ung Kim , Jae-Heung Ye
CPC classification number: H05K5/0004 , H01R4/02 , H05K1/18 , H05K5/0086 , H05K9/0007 , H05K9/0028
Abstract: According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.
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公开(公告)号：US10431887B2
公开(公告)日：2019-10-01
申请号：US15807094
申请日：2017-11-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jun-Young Kim , Sang-Seob Kim , Min Park , Jung-Je Bang , Beom-Ju Kim , Jae-Heung Ye , Yong-Won Lee , Jung-Sik Park
IPC: H05K7/00 , H01Q1/52 , H05K1/18 , H05K9/00 , H05K1/11 , H05K1/14 , G06F3/041 , H01Q1/48 , H01Q1/22 , H01L23/552 , H04M1/02 , H01Q1/24 , G06F3/044 , H04M1/03 , H01Q9/42 , H05K1/02
Abstract: An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.
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公开(公告)号：US20170318713A1
公开(公告)日：2017-11-02
申请号：US15476862
申请日：2017-03-31
Applicant: Samsung Electronics Co., Ltd
Inventor： Jung-Je Bang , Min Park , Jae-Heung Ye , Yong-won Lee , Sang-Seob Kim , Jun-Yeong Kim
IPC: H05K9/00
CPC classification number: H05K9/0083 , H05K9/0084 , H05K9/0088
Abstract: A shielding member is of a film type and includes an insulating layer, a shielding layer formed on a surface of the insulating layer, and a resin adhesive layer formed on a surface of the shielding layer. The resin adhesive layer may include a thermoplastic resin adhesive having an electrically conductive powder. The resin adhesive layer of the shielding member stably maintains connection with the ground after curing, thereby providing a stable operating environment of the electronic device.
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