公开(公告)号：US09024448B2

公开(公告)日：2015-05-05

申请号：US13785675

申请日：2013-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Gwon Jang ,  Young-Lyong Kim ,  Ae-Nee Jang

IPC: H01L23/48 ,  H01L23/495 ,  H01L21/56 ,  H01L23/13

CPC classification number: H01L23/49541 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L2224/16

Abstract: A semiconductor package may include a circuit board chip having a through-hole, a semiconductor device mounted on the circuit board chip, and an encapsulant. The encapsulant encapsulates the semiconductor device, fills the through-hole and has an external pattern that is the complement of a mold within which the encapsulant was formed. The external pattern on one side of the package reflects a mold shape that retards the flow of encapsulant material relative to the flow of encapsulant material on the opposite side of the package.

Abstract translation: 半导体封装可以包括具有通孔的电路板芯片，安装在电路板芯片上的半导体器件和密封剂。 密封剂封装半导体器件，填充通孔并具有作为其中形成密封剂的模具的互补体的外部图案。 包装的一侧上的外部图案反映了模制形状，该模具形状相对于包装材料的相对侧上的密封剂材料流延迟封装材料的流动。

公开(公告)号：US20140021593A1

公开(公告)日：2014-01-23

申请号：US13785675

申请日：2013-03-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Gwon Jang ,  Young-Lyong Kim ,  Ae-Nee Jang

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L2224/16

Abstract: A semiconductor package may include a circuit board chip having a through-hole, a semiconductor device mounted on the circuit board chip, and an encapsulant. The encapsulant encapsulates the semiconductor device, fills the through-hole and has an external pattern that is the complement of a mold within which the encapsulant was formed. The external pattern on one side of the package reflects a mold shape that retards the flow of encapsulant material relative to the flow of encapsulant material on the opposite side of the package.

Abstract translation: 半导体封装可以包括具有通孔的电路板芯片，安装在电路板芯片上的半导体器件和密封剂。 密封剂封装半导体器件，填充通孔并具有作为其中形成密封剂的模具的互补体的外部图案。 包装的一侧上的外部图案反映了模制形状，该模具形状相对于包装材料的相对侧上的密封剂材料流延迟封装材料的流动。

公开(公告)号：US09893020B2

公开(公告)日：2018-02-13

申请号：US15227953

申请日：2016-08-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Baik-Woo Lee ,  Eun-Seok Song ,  Young-Jae Kim ,  Jae-Gwon Jang

IPC: H01L43/02 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: In one embodiment, a semiconductor device comprising, a substrate comprising a wiring layer, a first conductive shielding layer disposed on the substrate and electrically isolated from the wiring layer, the first conductive shielding layer comprising a first bonding surface and a first end surface extending from the first bonding surface, a semiconductor chip disposed on the first conductive shielding layer, a molding member disposed over the first conductive shielding layer to cover the semiconductor chip, a second conductive shielding layer disposed over the first conductive shielding layer and the molding member, the second conductive shielding layer comprising a second bonding surface and a second end surface extending from the second bonding surface, and a bonding portion disposed between the first and second bonding surfaces, the bonding portion comprising a top surface and a bottom surface opposite to the top surface. The bottom surface of the bonding portion contacts the first bonding surface to form a first contact surface. The top surface of the bonding portion contacts the second bonding surface to form a second contact surface. An area of the second contact surface is larger than an area of the second end surface.