公开(公告)号：US10295564B2

公开(公告)日：2019-05-21

申请号：US15407660

申请日：2017-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Yong Park ,  Sang-Boo Kang ,  Jae-Geun Kim ,  Sung-Hyup Kim ,  Jeong-Min Na ,  Jae-Hyoung Park ,  Sang-Kyu Yoo ,  Jae-Hoon Joo

IPC: G01R1/073 ,  G01R1/04 ,  G01R31/28

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.