公开(公告)号：US20130200914A1

公开(公告)日：2013-08-08

申请号：US13749066

申请日：2013-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Do-Yun Kim ,  In-Seok Hwang ,  Sang-Boo Kang

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R3/00

Abstract: A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles.

Abstract translation: 在测试系统中清洁探针卡的针的方法包括将具有多个测试装置（DUT）和针的探针卡安装在卡安装部分中。 使用位于测试系统中的摄像机对DUT和针进行扫描，以提供扫描结果。 激光束基于扫描结果聚焦在至少一个针上，并且激光束被照射在至少一个针上以清洁至少一个针。

公开(公告)号：US09599663B2

公开(公告)日：2017-03-21

申请号：US14085945

申请日：2013-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang-Boo Kang ,  Ki-Sub Lim

IPC: G01R21/00 ,  G01R31/28

CPC classification number: G01R31/2874 ,  G01R31/2889

Abstract: A probe method includes setting an allowable temperature range, the allowable temperature range including a test temperature and ensuring contact between a pad of a circuit substrate and a needle of a probe card, providing the probe card with a temperature within the allowable temperature range, contacting the needle of the probe card to the pad of the circuit substrate, and supplying a test current to the pad through the needle to test the circuit substrate.

公开(公告)号：US10295564B2

公开(公告)日：2019-05-21

申请号：US15407660

申请日：2017-01-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Yong Park ,  Sang-Boo Kang ,  Jae-Geun Kim ,  Sung-Hyup Kim ,  Jeong-Min Na ,  Jae-Hyoung Park ,  Sang-Kyu Yoo ,  Jae-Hoon Joo

IPC: G01R1/073 ,  G01R1/04 ,  G01R31/28

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

公开(公告)号：US09322849B2

公开(公告)日：2016-04-26

申请号：US13749066

申请日：2013-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Do-Yun Kim ,  In-Seok Hwang ,  Sang-Boo Kang

IPC: G01R31/00 ,  G01R1/073 ,  G01R3/00

CPC classification number: G01R1/07342 ,  G01R3/00

Abstract: A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles.

Abstract translation: 在测试系统中清洁探针卡的针的方法包括将具有多个测试装置（DUT）和针的探针卡安装在卡安装部分中。 使用位于测试系统中的摄像机对DUT和针进行扫描，以提供扫描结果。 激光束基于扫描结果聚焦在至少一个针上，并且激光束被照射在至少一个针上以清洁至少一个针。