公开(公告)号：US20240146352A1

公开(公告)日：2024-05-02

申请号：US18405796

申请日：2024-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungjun LEE ,  Kyoungmok KIM ,  Kookjoo LEE ,  Sangha LEE ,  Sehyun PARK ,  Himchan YUN ,  Jaeho LIM ,  Soonho HWANG

IPC: H04B1/40 ,  H01Q1/24

CPC classification number: H04B1/40 ,  H01Q1/243

Abstract: An electronic device includes: an antenna radiator; a radio frequency (RF) circuit configured to process a RF signal; a feeding line electrically connecting the antenna radiator with the RF circuit; a plurality of points including one or more first points and one or more second points, the plurality of points being positioned on the feeding line; a switch circuit electrically coupled to the plurality of points, the switch circuit being disposed in a parallel structure with respect to the feeding line; a first lumped element disposed between the one or more first points and the one or more second points; and a second lumped element disposed between the one or more first points and at least one first terminal included in the switch circuit.

公开(公告)号：US20240380103A1

公开(公告)日：2024-11-14

申请号：US18781686

申请日：2024-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hojung NAM ,  Kyoungmok KIM ,  Jaeho LIM ,  Myeongjun KONG ,  Soonho HWANG

IPC: H01Q1/38 ,  H01Q1/24 ,  H01Q13/10 ,  H01R13/24

Abstract: An electronic device according to an embodiment comprises: a printed circuit board; a first electronic component electrically connected to the printed circuit board; a second electronic component electrically connected to the printed circuit board and facing one side surface of the first electronic component; a first conductive plate including a feeding point supporting the first electronic component and electrically connected to the printed circuit board; a second conductive plate spaced apart from the first conductive plate and supporting the second electronic component; and a plurality of bridges connecting the first conductive plate with the second conductive plate to form a slot, wherein a wireless communication circuit may be configured to communicate with an external electronic device through at least one frequency band using the first conductive plate and the second conductive plate.

公开(公告)号：US20230231303A1

公开(公告)日：2023-07-20

申请号：US18118352

申请日：2023-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungkoo PARK ,  Kyoungmok KIM ,  Seunghwan KIM ,  Jonghoon KIM ,  Jiyeon YUN ,  Jaeho LIM ,  Jaebong CHUN

IPC: H01Q1/27 ,  H01Q1/48

CPC classification number: H01Q1/273 ,  H01Q1/48

Abstract: An example wearable electronic device may include: a bridge; a first rim disposed in a first direction of the bridge, and a second rim disposed in a second direction of the bridge, the second direction being opposite to the first direction; and a first temple configured to be folded or unfolded with respect to the first rim using a first hinge part, and a second temple configured to be folded or unfolded with respect to the second rim using a second hinge part, wherein the first temple includes: a first printed circuit board on which a wireless communication circuit is disposed and a ground area is partially formed; a non-conductive area formed on a part of the ground area; a feeder wire disposed across the non-conductive area, and having a first end electrically connected to the wireless communication circuit using a signal path and a second end disposed adjacent to the ground area; a feeder point formed adjacent to the second end of the feeder wire and electrically connected to the feeder wire; and a first electronic component electrically connected to a part of the ground area, electrically connected to the feeder point, using a first conductive connection member, wherein the part of the ground area and at least a part of the first electronic component may be utilized as antennas.