公开(公告)号：US11833796B2

公开(公告)日：2023-12-05

申请号：US17846598

申请日：2022-06-22

Applicant: Samsung Electronics Co., Ltd. ,  HOYEON CO., LTD

Inventor： Minchur Kim ,  Jaekwang Lee

IPC: B32B37/10 ,  B32B37/00 ,  B32B38/18 ,  B29C63/00 ,  B29C63/02 ,  B29C65/00

CPC classification number: B32B37/10 ,  B32B37/0053 ,  B32B38/1808 ,  B29C63/0047 ,  B29C63/02 ,  B29C66/342 ,  B29C66/345 ,  B29C2063/0008 ,  B32B37/003 ,  B32B2307/51 ,  B32B2367/00 ,  B32B2375/00 ,  B32B2457/20

Abstract: The disclosure relates to a device (e.g., a jig) for attaching a protective film for protecting a display included in a foldable electronic device from impact and scratching. A film attaching apparatus for attaching a film to an electronic device is provided. The film attaching apparatus includes a display, wherein the film attaching apparatus may include a main body including a base plate, a jig disposed on a base plate and configured to seat the electronic device thereon, a film suction-fixing part inclined at a predetermined angle with respect to the jig, and a roller module disposed on the base plate and including a roller slidable above the jig, wherein the film suction-fixing part may include two or more divided suction areas which are sequentially arranged to correspond to a moving direction of the roller module and configured to have different suction forces.

公开(公告)号：US11893959B2

公开(公告)日：2024-02-06

申请号：US17710003

申请日：2022-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonsoo Kim ,  Youngjae Kim ,  Minho Lee ,  Jaekwang Lee

IPC: G09G5/10 ,  G06F3/01 ,  G01J5/10 ,  G01J5/02

CPC classification number: G09G5/10 ,  G01J5/10 ,  G06F3/011 ,  G01J5/022 ,  G09G2360/145

Abstract: An electronic device may include: a display having at least one hole disposed in at least a part thereof such that light from the outside can be transmitted therethrough; a light-emitting element disposed under the display and configured to output a first infrared ray to the outside; a first light-receiving element disposed under the display at a position corresponding to the at least one hole, and configured to receive a second infrared ray transmitted from the outside; a second light-receiving element disposed under the display at a position where light from the outside is shielded; and at least one processor configured to, based on that a first sensing value according to the second infrared ray, output from the first light-receiving element, satisfies a first specified condition, while the first infrared ray is output: based on that a second sensing value output from the second light-receiving element does not satisfy a second specified condition, identify that a proximate object exists, and based on that the second sensing value satisfies the second specified condition, identify that the proximate object does not exist.

公开(公告)号：US10952327B2

公开(公告)日：2021-03-16

申请号：US16254907

申请日：2019-01-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Seok Jang ,  Dongmin Jang ,  Geunje Park ,  Jaekwang Lee

IPC: H05K7/00 ,  H05K1/18 ,  H05K1/11

Abstract: A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.

公开(公告)号：US12159009B2

公开(公告)日：2024-12-03

申请号：US17713733

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changmin Han ,  Hyunki Kim ,  Huijun Shim ,  Jaekwang Lee

IPC: G06F3/042

Abstract: A touch display apparatus is provided. The touch display apparatus includes a display panel including a display surface, a light guide plate disposed over the display surface of the display panel and formed to emit light incident into one side surface of the light guide plate through an upper surface of the light guide plate, a first light source array disposed on one side of the light guide plate and including a plurality of infrared light sources configured to emit infrared rays to an one side surface of the light guide plate, a camera disposed on at least one side of the first light source array and configured to photograph infrared rays emitted through an entire area of the upper surface of the light guide plate, and a processor configured to recognize coordinates of an input object adjacent to the upper surface of the light guide plate using infrared rays images captured by the camera.

公开(公告)号：US11523506B2

公开(公告)日：2022-12-06

申请号：US17345815

申请日：2021-06-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaekwang Lee ,  Dongmin Jang ,  Hwanwook Park ,  Jaeseok Jang ,  Dohyung Kim

IPC: H05K1/14 ,  H05K1/11

Abstract: A module board is provided. The module board includes a plurality of first left terminals and a plurality of first right terminals. Each of the plurality of first left terminals includes a left upper body, a left lower body, and a left lower bar which are connected to one another and sequentially provided, each of the plurality of first right terminals includes a right upper body, a right lower body, and a right lower bar which are connected to one another and sequentially provided, and a first width of each of the left upper body and the right upper body is greater than a second width of each of the left lower bar and the right lower bar.

公开(公告)号：US20190335586A1

公开(公告)日：2019-10-31

申请号：US16254907

申请日：2019-01-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE-SEOK JANG ,  Dongmin Jang ,  Geunje Park ,  Jaekwang Lee

IPC: H05K1/18

Abstract: A semiconductor module includes a module substrate having a first side extending in a first direction, a plurality of upper packages disposed on a top surface of the module substrate and arranged in rows extending in the first direction, and a passive element disposed on the top surface of the module substrate. At least a portion of the passive element overlaps one of the upper packages when viewed in a plan view, and the upper packages of a first row are arranged to be shifted with respect to the upper packages of a second row in the first direction.