公开(公告)号：US20240136237A1

公开(公告)日：2024-04-25

申请号：US18213967

申请日：2023-06-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changui Hong ,  Minho Lee

IPC: H01L21/66 ,  G01R31/52 ,  G01R31/64 ,  H01L23/498

CPC classification number: H01L22/32 ,  G01R31/52 ,  G01R31/64 ,  H01L23/49805 ,  H01L23/49838 ,  H01L28/90

Abstract: A substrate includes a first input/output region; a first input pad provided in the first input/output region; a first output pad provided in the first input/output region; a first mounting region; a first positive pad provided in the first mounting region and connected to the first input pad; a first negative pad provided in the first mounting region connected to the first output pad; a second positive pad provided in the first mounting region; a second negative pad provided in the first mounting region; a second mounting region; a third positive pad provided in the second mounting region and connected to the second positive pad; a third negative pad provided in the second mounting region and connected to the second negative pad; a fourth positive pad provided in the second mounting region; a fourth negative pad provided in the second mounting region; a second input/output region; a second input pad provided in the second input/output region and connected to the fourth positive pad; and a second output pad provided in the second input/output region and connected to the fourth negative pad.

公开(公告)号：US20210074691A1

公开(公告)日：2021-03-11

申请号：US16874722

申请日：2020-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minho Lee ,  Jaewook Yoo

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/544 ,  H01L23/13 ,  H01L23/31 ,  H01L21/48 ,  H01L25/00

Abstract: Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

公开(公告)号：US20240234221A9

公开(公告)日：2024-07-11

申请号：US18213967

申请日：2023-06-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changui Hong ,  Minho Lee

IPC: H01L21/66 ,  G01R31/52 ,  G01R31/64 ,  H01L23/498

CPC classification number: H01L22/32 ,  G01R31/52 ,  G01R31/64 ,  H01L23/49805 ,  H01L23/49838 ,  H01L28/90

Abstract: A substrate includes a first input/output region; a first input pad provided in the first input/output region; a first output pad provided in the first input/output region; a first mounting region; a first positive pad provided in the first mounting region and connected to the first input pad; a first negative pad provided in the first mounting region connected to the first output pad; a second positive pad provided in the first mounting region; a second negative pad provided in the first mounting region; a second mounting region; a third positive pad provided in the second mounting region and connected to the second positive pad; a third negative pad provided in the second mounting region and connected to the second negative pad; a fourth positive pad provided in the second mounting region; a fourth negative pad provided in the second mounting region; a second input/output region; a second input pad provided in the second input/output region and connected to the fourth positive pad; and a second output pad provided in the second input/output region and connected to the fourth negative pad.

公开(公告)号：US11893959B2

公开(公告)日：2024-02-06

申请号：US17710003

申请日：2022-03-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yeonsoo Kim ,  Youngjae Kim ,  Minho Lee ,  Jaekwang Lee

IPC: G09G5/10 ,  G06F3/01 ,  G01J5/10 ,  G01J5/02

CPC classification number: G09G5/10 ,  G01J5/10 ,  G06F3/011 ,  G01J5/022 ,  G09G2360/145

Abstract: An electronic device may include: a display having at least one hole disposed in at least a part thereof such that light from the outside can be transmitted therethrough; a light-emitting element disposed under the display and configured to output a first infrared ray to the outside; a first light-receiving element disposed under the display at a position corresponding to the at least one hole, and configured to receive a second infrared ray transmitted from the outside; a second light-receiving element disposed under the display at a position where light from the outside is shielded; and at least one processor configured to, based on that a first sensing value according to the second infrared ray, output from the first light-receiving element, satisfies a first specified condition, while the first infrared ray is output: based on that a second sensing value output from the second light-receiving element does not satisfy a second specified condition, identify that a proximate object exists, and based on that the second sensing value satisfies the second specified condition, identify that the proximate object does not exist.

公开(公告)号：US20230131461A1

公开(公告)日：2023-04-27

申请号：US18079401

申请日：2022-12-12

Applicant: Samsung Electronics Co., Ltd

Inventor： Jooyeol RYU ,  Aram Kim ,  Yeonsoo Kim ,  Myeongkyun Baek ,  Dongil Son ,  Changgeun Oh ,  Minho Lee ,  Jaehyuk Cho

IPC: H02J50/60 ,  H02J50/00 ,  H02J7/00 ,  G06F3/16 ,  G06F3/01

Abstract: An electronic device include a microphone, a wireless charging circuit, a wireless communication circuit, and processor electrically connected with the microphone, the wireless charging circuit, and the wireless communication circuit. The processor acquires first information corresponding to an ambient sound of the electronic device through the microphone, acquires second information related to a sleep of a user from a wearable device through the wireless communication circuit, the wearable device being connected with the electronic device through wireless communication, and, when wireless charging is performed by using the wireless charging circuit, adjusts a charging voltage of the wireless charging, based on at least one of the first information or the second information.

公开(公告)号：US20230223387A1

公开(公告)日：2023-07-13

申请号：US18185526

申请日：2023-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minho Lee ,  Jaewook Yoo

IPC: H01L25/10 ,  H01L21/48 ,  H01L23/544 ,  H01L23/498 ,  B81C99/00 ,  H01L25/075 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/13 ,  H01L25/16 ,  H01L25/04 ,  H01L25/07

CPC classification number: H01L25/105 ,  H01L21/4857 ,  H01L23/544 ,  H01L23/49838 ,  B81C99/007 ,  H01L25/0756 ,  H01L25/0657 ,  H01L25/50 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/13 ,  H01L25/162 ,  H01L25/043 ,  H01L25/074 ,  H01L2224/0213 ,  H01L2224/75753 ,  H01L2225/1035 ,  H01L2223/5442 ,  H01L2224/0217 ,  H01L2224/0224 ,  H01L2225/1058 ,  H01L2223/54426

Abstract: Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

公开(公告)号：US11610871B2

公开(公告)日：2023-03-21

申请号：US16874722

申请日：2020-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minho Lee ,  Jaewook Yoo

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/544 ,  H01L23/13 ,  H01L23/31 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/075 ,  H01L25/04 ,  H01L25/16 ,  B81C99/00

Abstract: Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

公开(公告)号：US11073821B2

公开(公告)日：2021-07-27

申请号：US16248334

申请日：2019-01-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minho Lee ,  Youngwoong Kim

IPC: G05B19/418 ,  G06T7/00 ,  G06F16/23 ,  G06T7/20

Abstract: A server and a controlling method therefor are provided. The server includes a communicator, a memory, and a processor configured to receive first log information related to a first material generated in a first facility among facilities, the first facility belonging to a first process for manufacturing a product through the communicator, generate an identifier (ID) regarding the first material, generate tracking information on the first material based on the first log information, assign the ID to the tracking information, receive pieces of second log information generated in a second facility among the facilities, the second facility belonging to a second process following the first process through the communicator, identify second log information corresponding to the first material among the pieces of second log information based on the first log information included in the tracking information, and update the tracking information based on the identified second log information.