公开(公告)号：US20240129102A1

公开(公告)日：2024-04-18

申请号：US18396179

申请日：2023-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yunguk LEE ,  Inseong LEE ,  Jaewon CHOI ,  Yongwook PARK

IPC: H04L7/00 ,  H04B1/04 ,  H04B1/16 ,  H04B17/318

CPC classification number: H04L7/0008 ,  H04B1/04 ,  H04B1/16 ,  H04B17/318

Abstract: An electronic device is provided. The electronic device includes a speaker, a communication module for supporting Bluetooth communication, one or more processors and, memory storing one or more programs including computer-executable instructions that, when executed by the one or more processors, cause the electronic device to identify the received signal strength indication (RSSI) of a Bluetooth communication signal received from an external electronic device via the communication module, during executing a first function using the speaker, identify whether a second function using the speaker is executed together with the first function, control a frequency value of a driving clock of the one or more processor based on the RSSI and the first function and the second function being executed together, adjust the driving clock of the one or more processor to the first frequency value when the RSSI is included in a first range indicating a weak electric field, and adjust the driving clock to a second frequency value that is lower than the first frequency value when the RSSI is included in a second range indicating a strong electric field.

公开(公告)号：US20230156394A1

公开(公告)日：2023-05-18

申请号：US18096197

申请日：2023-01-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yunguk LEE ,  Jaewon KIM ,  Hayeon CHO ,  Jaewon CHOI ,  Seungnyun KIM ,  Wonhee LEE ,  Jaehyuk CHOI

IPC: H04R1/10 ,  G06F3/041

CPC classification number: H04R1/1041 ,  G06F3/0416

Abstract: Disclosed is an electronic device including: at least one sensor including a proximity sensor, a touch sensor, and a processor operatively connected with the at least one sensor and the touch sensor. The processor is configured to: detect a distance between an external object and the electronic device using the proximity sensor, disable the touch sensor or ignore a signal from the touch sensor based on the distance between the external object and the electronic device being less than a certain distance, determine whether the electronic device meets a specified condition based on a sensing value obtained from the at least one sensor, and enable the touch sensor or recognize the signal from the touch sensor based on the electronic device meeting the specified condition.

公开(公告)号：US20210117761A1

公开(公告)日：2021-04-22

申请号：US16857740

申请日：2020-04-24

Applicant: Samsung Electronics Co., Ltd ,  Seoul National University R&DB Foundation

Inventor： Yuhwan Ro ,  Byeongho KIM ,  Jaehyun Park ,  Jungho AHN ,  Minbok WI ,  Sunjung LEE ,  Eojin LEE ,  Wonkyung JUNG ,  Jongwook CHUNG ,  Jaewon CHOI

IPC: G06N3/063 ,  G06N3/08 ,  G06N20/10 ,  G06F9/30 ,  G06F9/38 ,  G06F17/16

Abstract: A processor-implemented data processing method includes: generating compressed data of first matrix data based on information of a distance between valid elements included in the first matrix data; fetching second matrix data based on the compressed data; and generating output matrix data based on the compressed data and the second matrix data.

公开(公告)号：US20230183881A1

公开(公告)日：2023-06-15

申请号：US17974239

申请日：2022-10-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaewon CHOI ,  Jaesik CHUNG

IPC: C25D17/00

CPC classification number: C25D17/004 ,  C25D17/001 ,  C25D17/007

Abstract: A plating apparatus may include a body, a lip seal structure connected to the body, and a conductive liquid. The body may include a cathode. The lip seal structure may be configured to hold a wafer. The lip seal structure may include a bottom portion, a contact portion connected to the bottom portion and contacting the wafer, and at least one partition structure protruding from an upper surface of the bottom portion. The conductive liquid may cover the upper surface of the bottom portion and may be configured to electrically connect the cathode and the wafer.

公开(公告)号：US20230156395A1

公开(公告)日：2023-05-18

申请号：US18099449

申请日：2023-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Juntaek OH ,  Jaewon CHOI

IPC: H04R1/10

CPC classification number: H04R1/1041

Abstract: Various embodiments relate to an electronic device comprising a touch electrode. The electronic device may comprise: a housing comprising a first microphone hole; a first printed circuit board positioned inside the housing; a touch sensor circuit comprising a touch sensor positioned on the first printed circuit board; at least one microphone configured to collect external sound; at least one second printed circuit board electrically connected to the first printed circuit board, including a first surface facing an interior of the housing, in which the microphone is positioned, and comprises a second microphone hole, and a first touch electrode electrically connected to the touch sensor circuit by being positioned on a second surface, which is a surface opposite the first surface, to surround the second microphone hole, wherein the second printed circuit board is disposed between the housing and the first printed circuit board so that the second microphone hole corresponds to the first microphone hole; and a conductive pattern positioned to cover at least a portion of the first touch electrode, and electrically connected to the touch sensor circuit.

公开(公告)号：US20210183780A1

公开(公告)日：2021-06-17

申请号：US17096107

申请日：2020-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungbum KIM ,  Taewoo KANG ,  Jaewon CHOI

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package may include a lower package including a first substrate, a first semiconductor chip on the first substrate, and a first molding portion on the first substrate to cover the first semiconductor chip, an interposer substrate on the first semiconductor chip, a supporting portion between the interposer substrate and the first substrate to support the interposer substrate, a connection terminal connecting the interposer substrate to the first substrate, and an upper package on the interposer substrate. The upper package may include a second substrate, a second semiconductor chip on the second substrate, and a second molding portion on the second substrate to cover the second semiconductor chip.

公开(公告)号：US20160247306A1

公开(公告)日：2016-08-25

申请号：US15051867

申请日：2016-02-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： DongJun JANG ,  Yongman LEE ,  Daehyun YOO ,  Jaehun CHO ,  Jaewon CHOI ,  Soohyung KIM

IPC: G06T11/60

CPC classification number: G06F3/14 ,  G09G2310/04 ,  G09G2330/021 ,  G09G2340/10

Abstract: An apparatus and a method for controlling a display so as to reduce power consumption in an electronic device having a plurality of processors are provided. The apparatus includes a display and a control unit. The display is configured to display information formed by a first image and a second image. The first image corresponds to a partial region of the information, and the second image corresponds to a background region of the information. The control unit includes a first processor and a second processor. The processor may be configured to transmit the first image to the second processor in response to a request for displaying the information on the display. The second processor may be configured to store the second image in a memory and control the display to display the received first image together with the second image.

Abstract translation: 提供了一种用于控制显示器以减少具有多个处理器的电子设备中的功耗的装置和方法。 该装置包括显示器和控制单元。 显示器被配置为显示由第一图像和第二图像形成的信息。 第一图像对应于信息的部分区域，第二图像对应于信息的背景区域。 控制单元包括第一处理器和第二处理器。 处理器可以被配置为响应于在显示器上显示信息的请求而将第一图像发送到第二处理器。 第二处理器可以被配置为将第二图像存储在存储器中并且控制显示器以与第二图像一起显示接收到的第一图像。