公开(公告)号：US12068157B2

公开(公告)日：2024-08-20

申请号：US17385069

申请日：2021-07-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Seung Ha ,  Jang Hoon Kim ,  Tae-Kyu Kim ,  Young Kuk Byun ,  Jong Hyun Jung

IPC: H01L21/027 ,  G03F7/00 ,  G03F7/20 ,  H01L21/66

CPC classification number: H01L21/0274 ,  G03F7/70633 ,  H01L22/12

Abstract: A method of manufacturing a semiconductor device includes forming a first lower overlay key including first and second patterns in a lower layer, forming a first upper overlay key including third and fourth patterns in an upper layer vertically disposed on the lower layer, irradiating a first measurement light to a first region of interest (ROI) over first portions of the first and second patterns to detect a first overlay error and irradiating a second measurement light to a second ROI over second portions of the first and second patterns, the second ROI being different from the first ROI, to detect a second overlay error.

公开(公告)号：US20220093393A1

公开(公告)日：2022-03-24

申请号：US17322412

申请日：2021-05-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang Hoon Kim ,  Soo Kyung Kim ,  Tae-Kyu Kim ,  Young Kuk Byun ,  Woo Jin Jung

IPC: H01L21/027 ,  H01L21/311

Abstract: A method of manufacturing a semiconductor device includes forming a mold layer on a semiconductor wafer having a plurality of integrated circuit die at least partially defined therein. An etch stopper film is selectively formed on a second portion of the mold layer extending adjacent a periphery of the semiconductor wafer, but not on a first portion of the mold layer extending opposite at least one of the plurality of integrated circuit die. A preliminary pattern layer is formed on the etch stopper film and on the first portion of the mold layer. A plurality of patterns are formed in the preliminary pattern layer by selectively exposing the preliminary pattern layer to extreme ultraviolet light (EUV). Then, hole patterns are selectively formed in the first portion of the mold layer, using the exposed preliminary pattern layer and the etch stopper film as an etching mask.

公开(公告)号：US12033855B2

公开(公告)日：2024-07-09

申请号：US17322412

申请日：2021-05-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang Hoon Kim ,  Soo Kyung Kim ,  Tae-Kyu Kim ,  Young Kuk Byun ,  Woo Jin Jung

IPC: H01L21/027 ,  H01L21/311

CPC classification number: H01L21/0274 ,  H01L21/31144

Abstract: A method of manufacturing a semiconductor device includes forming a mold layer on a semiconductor wafer having a plurality of integrated circuit die at least partially defined therein. An etch stopper film is selectively formed on a second portion of the mold layer extending adjacent a periphery of the semiconductor wafer, but not on a first portion of the mold layer extending opposite at least one of the plurality of integrated circuit die. A preliminary pattern layer is formed on the etch stopper film and on the first portion of the mold layer. A plurality of patterns are formed in the preliminary pattern layer by selectively exposing the preliminary pattern layer to extreme ultraviolet light (EUV). Then, hole patterns are selectively formed in the first portion of the mold layer, using the exposed preliminary pattern layer and the etch stopper film as an etching mask.

公开(公告)号：US20240005476A1

公开(公告)日：2024-01-04

申请号：US18141690

申请日：2023-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Su KANG ,  Jang Hoon Kim ,  Woo Jin Jung

IPC: G06T7/00 ,  G06T7/13

CPC classification number: G06T7/0006 ,  G06T7/13 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: An image processing system, including an input interface configured to receive a first direction image corresponding to a view of a semiconductor device in a first direction, and a second direction image corresponding to a view of the semiconductor device in a second direction which intersects the first direction at a first height at which the first direction image is generated; a processor configured to perform an edge detection operation for detecting an edge based on the first direction image, and to perform an image binarization operation on the first direction image; and a learning device configured to compare a first line width obtained based on the image binarization operation, and a second line width obtained based on the second direction image through machine learning, and to learn a condition of the image binarization operation which maximizes a correlation between the first line width and the second line width.