Method and apparatus for recognizing target device, for augmented reality

    公开(公告)号:US12217504B2

    公开(公告)日:2025-02-04

    申请号:US18112726

    申请日:2023-02-22

    Abstract: An electronic device may include a display, a camera, a communication circuitry, and a processor, wherein the processor may be configured to: control to transmit an image obtained through the camera to an external device through the communication circuitry, receive an AR image including at least one object from the external device through the communication circuitry and display same through the display, recognize a target object from among the at least one object, and map one of peripheral devices found on a data communication link through the communication circuitry to a target device corresponding to the recognized target object. Various embodiments are possible.

    SEMICONDUCTOR DEVICES
    5.
    发明公开

    公开(公告)号:US20240172421A1

    公开(公告)日:2024-05-23

    申请号:US18233357

    申请日:2023-08-14

    CPC classification number: H10B12/482 H10B12/0335 H10B12/315

    Abstract: A semiconductor device includes an active pattern on a substrate. A bit line structure is on the active pattern. A spacer structure is on a sidewall of the bit line structure. A lower contact plug directly contacts the spacer structure. The spacer structure includes a first spacer covering an upper sidewall of the lower contact plug and a second spacer covering a lower sidewall of the lower contact plug and a portion of a lower surface of the lower contact plug. The lower contact plug includes an extension portion covered by the first and second spacers and a protrusion portion protruding from the first and second spacers. A bottom surface of the protrusion portion is disposed at a level that is lower than or equal to a level of a bottom surface of the second spacer.

    Electronic device connected to external electronic device through wireless communication channel by using TDLS session defined by IEEE 802.11 standard

    公开(公告)号:US11924894B2

    公开(公告)日:2024-03-05

    申请号:US17291053

    申请日:2019-08-07

    CPC classification number: H04W76/12 H04W76/14 H04W84/12

    Abstract: An electronic device according to various embodiments comprises: at least one wireless communication circuit configured to transmit and receive wireless signals according to IEEE 802.11 standard; a processor operatively connected to the wireless communication circuit; and a memory operatively connected to the processor, wherein the memory can store instructions allowing, when executed, the processor to: receive a first request message for a tunneled direct link setup (TDLS) session defined by the IEEE 802.11 standard from a first access point (AP) through the wireless communication circuit; determine, on the basis of the first request message, that an external electronic device having requested the TDLS session is connected to a second AP; establish a connection to the second AP through the wireless communication circuit on the basis of the determination; transmit a second request message for the TDLS session to the second AP; and establish the TDLS session with the external electronic device through the second AP on the basis of the reception of a response message to the second request message from the external electronic device. Additional various embodiments are possible.

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