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1.发明申请SUBSTRATE ASSEMBLY, METHOD OF FORMING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME 有权基板组件，其形成方法和包括其的电子器件公开(公告)号：US20140287244A1
公开(公告)日：2014-09-25
申请号：US14063529
申请日：2013-10-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyeon-jin SHIN , Sang-Woo KIM , Jin yeong LEE
CPC classification number: B32B15/04 , B32B2457/00 , C23C16/342 , C23C28/34 , H01L21/02458 , Y10T428/31678
Abstract: A substrate assembly includes a first hexagonal boron nitride sheet directly bonded to a surface of a substrate, and a metal layer on the first hexagonal boron nitride sheet.
Abstract translation: 基板组件包括直接接合到基板的表面的第一六边形氮化硼片和在第一六边形氮化硼片上的金属层。
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2.发明申请公开(公告)号：US20170282502A1
公开(公告)日：2017-10-05
申请号：US15628891
申请日：2017-06-21
Applicant: Samsung Electronics Co., Ltd. , Sungkyunkwan University Foundation for Corporate Collaboration
Inventor： Hyeon-jin SHIN , Sang-Woo KIM , Jin yeong LEE
CPC classification number: B32B15/04 , B32B2457/00 , C23C16/342 , C23C28/34 , H01L21/02458 , Y10T428/31678
Abstract: A substrate assembly includes a first hexagonal boron nitride sheet directly bonded to a surface of a substrate, and a metal layer on the first hexagonal boron nitride sheet.
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