公开(公告)号：US20220372078A1

公开(公告)日：2022-11-24

申请号：US17578720

申请日：2022-01-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soonchun CHUNG ,  Ginam KIM ,  Jieun KIM ,  Jinha KIM ,  Joonsong PARK

IPC: C07K14/00 ,  G03F7/039

Abstract: A polypeptide, a photoresist composition including the polypeptide, a photoresist including the polypeptide, and a method of forming patterns using the photoresist composition.

公开(公告)号：US20230183294A1

公开(公告)日：2023-06-15

申请号：US17741590

申请日：2022-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jieun KIM ,  Soonchun CHUNG ,  Jinha KIM ,  Joonsong PARK

IPC: C07K14/00 ,  G03F7/039

CPC classification number: C07K14/001 ,  G03F7/0392

Abstract: A polypeptide including a region A, a region B, and a region C, a photoresist composition including the polypeptide, and a method of forming patterns by using the photoresist composition.

公开(公告)号：US20230176480A1

公开(公告)日：2023-06-08

申请号：US17741692

申请日：2022-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinha KIM ,  Soonchun CHUNG ,  Jieun KIM ,  Joonsong PARK

IPC: G03F7/038 ,  C07K14/00 ,  G03F7/32

CPC classification number: G03F7/0387 ,  C07K14/001 ,  G03F7/32 ,  G03F7/2006

Abstract: A polypeptide, a photoresist composition including the polypeptide, and a method of forming patterns by using the photoresist composition.