公开(公告)号：US20210033413A1

公开(公告)日：2021-02-04

申请号：US16966633

申请日：2019-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soojeong BAE ,  Gilyong PARK ,  Hongjin BAK ,  Jiyoung LEE ,  Taiwook JWA

IPC: G01C21/34 ,  G01C21/36

Abstract: The disclosure relates to a method and apparatus for providing route information, The method of providing the route information, the method being performed by a base station, according to an embodiment of the disclosure, may include obtaining information about a route between a location of a user and a destination requested by the user, receiving metadata representing at least one of a geographical feature and an object within a preset coverage from a connectivity node, determining a final route to the destination based on the obtained information about the route and the received metadata, and transmitting information about the determined final route to a terminal of the user.

公开(公告)号：US20190341042A1

公开(公告)日：2019-11-07

申请号：US16383968

申请日：2019-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hogon KIM ,  Jaeho SEO ,  Byungsoo KIM ,  Bumsu SHIN ,  Jiyoung LEE

IPC: G10L15/22 ,  H04L29/08 ,  G06F3/16

Abstract: An electronic device and a computer program product are provided herein. The electronic device includes: an audio module, a communication module, a microphone, a memory storing programming instructions, and a processor, which executes the program product, causing the electronic device to receive a voice command from a user via the microphone, request, upon receiving the voice command, situation information from a first external electronic device based on device information and the voice command, and after receiving the situation information, transmit the situation information to a second external electronic device via the communication module, and receiving content corresponding to the situation information from the second external electronic device and reproducing the received content

公开(公告)号：US20240061492A1

公开(公告)日：2024-02-22

申请号：US18180427

申请日：2023-03-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumgyu PARK ,  Jonglae PARK ,  Choonghoon PARK ,  Daeyeong LEE ,  Jiyoung LEE ,  Hyunwook JOO

IPC: G06F1/3234 ,  G06F1/20

CPC classification number: G06F1/3275 ,  G06F1/206

Abstract: A processor includes a central processing unit (CPU) configured to drive a dynamic voltage and frequency scaling (DVFS) module, a memory hierarchy configured to store data for an operation of the CPU, and an activity monitoring unit (AMU) configured to generate microarchitecture information by monitoring performance of the CPU or monitoring traffic of a system bus connected to the memory hierarchy. The DVFS module is configured to determine a layer within the memory hierarchy in which a memory stall occurs using the microarchitecture information, and to increase a frequency in response to the determined layer being accessed.

公开(公告)号：US20230178470A1

公开(公告)日：2023-06-08

申请号：US18074007

申请日：2022-12-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyoung LEE

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L21/56 ,  H01L21/4846 ,  H01L23/49822 ,  H01L24/16

Abstract: A semiconductor package is provided. The semiconductor package includes a first redistribution layer, a first semiconductor chip disposed on the first redistribution layer, a molding layer disposed on the first redistribution layer to cover a side surface of the first semiconductor chip, a second redistribution layer disposed on the molding layer, and a connecting pillar disposed to penetrate the molding layer and configured to connect the first redistribution layer to the second redistribution layer, the connecting pillar including a lower area having a first width in a first direction parallel to an upper surface of the first semiconductor chip and an upper area integrally connected to the lower area and having a second width that is less than the first width in the first direction.