ELECTROSTATIC DISCHARGE PROTECTION DEVICE

    公开(公告)号:US20220231126A1

    公开(公告)日:2022-07-21

    申请号:US17542728

    申请日:2021-12-06

    Abstract: An electrostatic discharge protection device includes: an emitter region disposed on a semiconductor substrate; a base region surrounding the emitter region; a first collector region surrounding the base region; a second collector region surrounding the first collector region; a second conductivity-type drift region below the emitter region, and being deeper than the base region; a second conductivity-type well region disposed below the base region, and having a junction interface with the second conductivity-type drift region; and a plurality of isolation portions disposed between the emitter region, the base region, and the first collector region and the second collector region.

    SEMICONDUCTOR DEVICE
    2.
    发明申请

    公开(公告)号:US20240405014A1

    公开(公告)日:2024-12-05

    申请号:US18405843

    申请日:2024-01-05

    Abstract: The present disclosure relates to semiconductor devices. An example semiconductor device includes a first well region and a second well region isolated from each other by a first device isolation film; an NPN transistor provided by a first collector region formed in the first well region and including first conductivity-type impurities, and a first emitter region formed in the second well region and including the first conductivity-type impurities; a PNP transistor provided by a second emitter region formed in the first well region and including second conductivity-type impurities different from the first conductivity-type, and a second collector region formed in the second well region and including the second conductivity-type impurities; and an NMOS transistor including a source region and a drain region formed in the second well region and including the first conductivity-type impurities, and a gate structure disposed between the source region and the drain region.

    SEMICONDUCTOR DEVICE
    3.
    发明公开

    公开(公告)号:US20240259008A1

    公开(公告)日:2024-08-01

    申请号:US18236303

    申请日:2023-08-21

    CPC classification number: H03K17/08

    Abstract: A semiconductor device is provided. The semiconductor device includes: a first power pad; a second power pad; a signal pad; a clamping circuit connected between the first power pad and the second power pad; a driving circuit connected to the signal pad and including a pull-up circuit and a pull-down circuit; and a first gate-off circuit connected to the pull-down circuit. The first gate-off circuit is configured to connect a gate of the pull-down circuit and a source of the pull-down circuit to each other during an electrostatic discharge (ESD) event in which a high voltage is applied to the signal pad, and control a current generated by the high voltage to flow to the clamping circuit.

    Electrostatic discharge protection device

    公开(公告)号:US11908895B2

    公开(公告)日:2024-02-20

    申请号:US17542728

    申请日:2021-12-06

    CPC classification number: H01L29/0821 H01L29/735

    Abstract: An electrostatic discharge protection device includes: an emitter region disposed on a semiconductor substrate; a base region surrounding the emitter region; a first collector region surrounding the base region; a second collector region surrounding the first collector region; a second conductivity-type drift region below the emitter region, and being deeper than the base region; a second conductivity-type well region disposed below the base region, and having a junction interface with the second conductivity-type drift region; and a plurality of isolation portions disposed between the emitter region, the base region, and the first collector region and the second collector region.

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