METHOD AND APPARATUS FOR MEASURING PERFORMANCE OF ELECTRONIC DEVICE
    2.
    发明申请
    METHOD AND APPARATUS FOR MEASURING PERFORMANCE OF ELECTRONIC DEVICE 有权
    用于测量电子设备性能的方法和装置

    公开(公告)号:US20130082717A1

    公开(公告)日:2013-04-04

    申请号:US13644793

    申请日:2012-10-04

    CPC classification number: G01R31/001 G01R29/0871 G01R31/002 H04M1/24

    Abstract: A method and an apparatus for measuring performance of an electronic device are provided. The apparatus includes an electromagnetic wave measuring device for measuring an actual level of an electromagnetic wave of an electronic device, and an analysis controller for applying a previously stored level change value to the actual level of the electromagnetic wave to compute a measured level of the electromagnetic wave. The method and the apparatus for measuring performance of an electronic device can easily measure an electromagnetic wave level of the electronic device without using a device suggested by an international standard.

    Abstract translation: 提供了一种用于测量电子设备性能的方法和装置。 该装置包括用于测量电子设备的电磁波的实际电平的电磁波测量装置和用于将预先存储的电平变化值应用于电磁波的实际电平的分析控制器,以计算电磁波的测量电平 波。 用于测量电子设备性能的方法和装置可以容易地测量电子设备的电磁波水平,而不使用国际标准建议的设备。

    ELECTRONIC DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE AND OPERATING METHOD OF ELECTRONIC DEVICE

    公开(公告)号:US20230028712A1

    公开(公告)日:2023-01-26

    申请号:US17701520

    申请日:2022-03-22

    Abstract: Disclosed is an operating method of an electronic device which includes receiving a design layout for manufacturing the semiconductor device, generating a first layout by performing machine learning-based process proximity correction (PPC), generating a second layout by performing optical proximity correction (OPC), and outputting the second layout for a semiconductor process. The generating of the first layout includes generating a first after cleaning inspection (ACI) layout by executing a machine learning-based process proximity correction module on the design layout, generating a second after cleaning inspection layout by adjusting the design layout based on a difference of the first after cleaning inspection layout and the design layout and executing the process proximity correction module on the adjusted layout, and outputting the adjusted layout as the first layout, when a difference between the second after cleaning inspection layout and the design layout is smaller than or equal to a threshold value.

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