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公开(公告)号：US20190035750A1
公开(公告)日：2019-01-31
申请号：US15997338
申请日：2018-06-04
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hoon Han , Sungjin KIM , Junyong NOH , Heonjun LIM
Abstract: A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a lower dielectric layer on the semiconductor substrate, a chip pad on the lower dielectric layer of the chip region, an upper dielectric layer on the lower dielectric layer, which includes a first opening exposing the chip pad on the chip region and a second opening exposing the lower dielectric layer on the edge region, and a redistribution pad connected to the chip pad. The redistribution pad includes a via portion in the first opening and a pad portion extending from the via portion onto the upper dielectric layer.
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公开(公告)号：US20230252707A1
公开(公告)日：2023-08-10
申请号：US17980817
申请日：2022-11-04
Inventor： Seokpyo HONG , Junyong NOH , Soojin CHOI , Chaelin KIM , Kyungmin CHO , Jiyeon KIM
IPC: G06T13/40
CPC classification number: G06T13/40
Abstract: An apparatus that transfers object motion in a source space to a target space is provided. The apparatus defines a mapping function from the source space to the target space based on feature points of the object-positioned source space, and feature points of the object-represented target space; determines a target root position corresponding to a root position of the object based on the mapping function; determines a target direction corresponding to a direction of the object, based on the mapping function; determines a target main joint corresponding to a main joint of the object based on the mapping function; determines a target sub-joint excluding the target main joint in the target space based on unique joint information of the object; and generates data representing the object motion in the target space by modifying a pose of the object in the target space to match the target main joint.
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Patent Agency Ranking
3.发明申请公开(公告)号：US20210175133A1
公开(公告)日：2021-06-10
申请号：US16898943
申请日：2020-06-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minjung CHOI , Junyong NOH , Yeonjin LEE , Junghoon HAN
Abstract: A semiconductor device includes a substrate including a first part and a second part, a memory cell disposed on the first part, an insulation layer disposed on the first part and the second part, the insulation layer covering the memory cell, a portion of the insulation layer on the second part including a stepped sidewall, and a first pattern group disposed on the second part and in the portion of the insulation layer and the substrate. A first sidewall of the semiconductor device corresponds to the stepped sidewall including an upper sidewall, a lower sidewall and a connecting surface connecting the upper sidewall to the lower sidewall. The lower sidewall disposed under the upper sidewall is closer to the substrate than the upper sidewall, and has surface roughness different from surface roughness of the upper sidewall.
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公开(公告)号：US20200058543A1
公开(公告)日：2020-02-20
申请号：US16420328
申请日：2019-05-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-Hoon HAN , Seokhwan KIM , Joodong KIM , Junyong NOH , Jaewon SEO
IPC: H01L21/768 , H01L23/00
Abstract: A semiconductor device including a semiconductor substrate including a chip region and an edge region around the chip region; a lower dielectric layer and an upper dielectric layer on the semiconductor substrate; a redistribution chip pad that penetrates the upper dielectric layer on the chip region and is connected a chip pad; a process monitoring structure on the edge region; and dummy elements in the edge region and having an upper surface lower than an upper surface of the upper dielectric layer.
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公开(公告)号：US20220245879A1
公开(公告)日：2022-08-04
申请号：US17333278
申请日：2021-05-28
Inventor： Junyong NOH , Kyungmin CHO , Chaelin KIM
Abstract: A character animation motion control method and device are disclosed. A character animation playing method, including extracting first actions based on a state of a character, extracting second actions based on the state, selecting an action included in the first actions and the second actions, and updating the state based on the action.
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6.发明申请公开(公告)号：US20220223485A1
公开(公告)日：2022-07-14
申请号：US17706401
申请日：2022-03-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minjung CHOI , Junyong NOH , Yeonjin LEE , Junghoon HAN
Abstract: A semiconductor device includes a substrate including a first part and a second part, a memory cell disposed on the first part, an insulation layer disposed on the first part and the second part, the insulation layer covering the memory cell, a portion of the insulation layer on the second part including a stepped sidewall, and a first pattern group disposed on the second part and in the portion of the insulation layer and the substrate. A first sidewall of the semiconductor device corresponds to the stepped sidewall including an upper sidewall, a lower sidewall and a connecting surface connecting the upper sidewall to the lower sidewall. The lower sidewall disposed under the upper sidewall is closer to the substrate than the upper sidewall, and has surface roughness different from surface roughness of the upper sidewall.
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公开(公告)号：US20220005730A1
公开(公告)日：2022-01-06
申请号：US17482796
申请日：2021-09-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jung-Hoon HAN , Seokhwan KIM , Joodong KIM , Junyong NOH , Jaewon SEO
IPC: H01L21/768 , H01L23/00
Abstract: A semiconductor device including a semiconductor substrate including a chip region and an edge region around the chip region; a lower dielectric layer and an upper dielectric layer on the semiconductor substrate; a redistribution chip pad that penetrates the upper dielectric layer on the chip region and is connected a chip pad; a process monitoring structure on the edge region; and dummy elements in the edge region and having an upper surface lower than an upper surface of the upper dielectric layer.
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