公开(公告)号：US20230068587A1

公开(公告)日：2023-03-02

申请号：US17853205

申请日：2022-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yae Jung YOON ,  Eung Kyu KIM ,  Min Jun BAE ,  Kyoung Lim SUK ,  Seok Hyun LEE ,  Jae Gwon JANG

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/18 ,  H01L23/053

Abstract: A semiconductor package including a passivation film, a mold layer on the passivation film, a connecting pad having a T shape, the T shape including a first portion and a second portion on the first portion, the first portion penetrating the passivation film, the second portion penetrating a part of the mold layer, a solder ball on the first portion of the connecting pad, an element on the second portion of the connecting pad, a wiring structure on the mold layer, the wiring structure including an insulating layer and a wiring pattern inside the insulating layer, and a semiconductor chip on the wiring structure may be provided.

公开(公告)号：US20240014163A1

公开(公告)日：2024-01-11

申请号：US18312191

申请日：2023-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong Youn KIM ,  Eung Kyu KIM ,  Min Jun BAE ,  Hyeon Seok LEE ,  Seok Kyu CHOI

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC classification number: H01L24/32 ,  H01L24/16 ,  H01L24/08 ,  H01L24/73 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L25/162 ,  H01L2224/08235 ,  H01L24/48 ,  H01L2224/26175 ,  H01L2924/1205 ,  H01L2224/16168 ,  H01L2224/32155 ,  H01L2224/48228 ,  H01L2224/73204

Abstract: A semiconductor package includes a redistribution substrate having a first side and an opposite second side, a semiconductor chip on the first side of the redistribution substrate, a silicon capacitor on the second side of the redistribution substrate, a plurality of solder balls on the second side of the redistribution substrate and adjacent the silicon capacitor, and a metal pattern in the redistribution substrate and positioned between the silicon capacitor and the solder balls. The metal pattern includes a first portion extending in a first direction, and a second portion connected to the first portion and extending in a second direction different from the first direction.

公开(公告)号：US20210111163A1

公开(公告)日：2021-04-15

申请号：US16885391

申请日：2020-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Jun BAE ,  Dong Kyu KIM ,  Jin-Woo PARK ,  Seok Hyun LEE

IPC: H01L25/10 ,  H01L25/065 ,  H01L25/00

Abstract: A semiconductor package includes a first redistribution layer. A plurality of posts is disposed on the first redistribution layer. A semiconductor chip is disposed on the first redistribution layer between the plurality of posts. A second redistribution layer is formed on the plurality of posts and the semiconductor chip. A first memory stack is disposed on the second redistribution layer. A height of each of the plurality of posts extends from an upper surface of the first redistribution layer to a lower surface of the second redistribution layer.