公开(公告)号：US20240222280A1

公开(公告)日：2024-07-04

申请号：US18363995

申请日：2023-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： MyungDo CHO ,  Youngchan KO ,  Gyeongho KIM ,  Byung Ho KIM ,  Yongkoon LEE ,  Jeongho LEE

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/5381 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/49866 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/182

Abstract: A semiconductor package may include: a first redistribution layer structure; a bridge structure on the first redistribution layer structure; a plurality of conductive pillars on the first redistribution layer structure and side by side with the bridge structure; an encapsulant molding the bridge structure and the plurality of conductive pillars on the first redistribution layer structure; a second redistribution layer structure on the encapsulant, wherein a region of the second redistribution layer structure on the bridge structure is defined as a first region and a region other than the first region is defined as a second region; and a plurality of bonding pads at the first region. A vertical thickness of the first region may be smaller than a vertical thickness of the second region.