公开(公告)号：US20240222280A1

公开(公告)日：2024-07-04

申请号：US18363995

申请日：2023-08-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： MyungDo CHO ,  Youngchan KO ,  Gyeongho KIM ,  Byung Ho KIM ,  Yongkoon LEE ,  Jeongho LEE

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/5381 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/49866 ,  H01L23/5385 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/182

Abstract: A semiconductor package may include: a first redistribution layer structure; a bridge structure on the first redistribution layer structure; a plurality of conductive pillars on the first redistribution layer structure and side by side with the bridge structure; an encapsulant molding the bridge structure and the plurality of conductive pillars on the first redistribution layer structure; a second redistribution layer structure on the encapsulant, wherein a region of the second redistribution layer structure on the bridge structure is defined as a first region and a region other than the first region is defined as a second region; and a plurality of bonding pads at the first region. A vertical thickness of the first region may be smaller than a vertical thickness of the second region.

公开(公告)号：US20240071895A1

公开(公告)日：2024-02-29

申请号：US18353279

申请日：2023-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seoeun KYUNG ,  Byung Ho KIM ,  Youngbae KIM ,  Hongwon KIM ,  Seokwon LEE ,  Jae-Ean LEE ,  Dahee KIM

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L23/49838 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/105 ,  H01L25/18 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/5385 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058

Abstract: A semiconductor package may include a lower redistribution layer including a lower wiring and a lower via, an embedded region on the lower redistribution layer, a core layer on the lower redistribution layer and including a core via, and an under bump structure including an under bump pad on a lower surface of the lower redistribution layer and an under bump via connecting the lower wiring and the under bump pad, the under bump pad may overlap the under bump via, the lower via, and the core via in a plan view, and the under bump via may be spaced apart from at least one of the lower via and the core via in the plan view.

公开(公告)号：US20200075492A1

公开(公告)日：2020-03-05

申请号：US16216946

申请日：2018-12-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joo Young CHOI ,  Doo Hwan LEE ,  Da Hee KIM ,  Jae Hoon CHOI ,  Byung Ho KIM

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A semiconductor package includes a connection member having a first surface and a second surface opposing each other and including a first redistribution layer on the second surface and at least one second redistribution layer on a level different from a level of the first redistribution layer; a semiconductor chip on the first surface of the connection member; a passivation layer on the second surface of the connection member, and including openings; UBM layers connected to the first redistribution layer through the openings; and electrical connection structures on UBM layers. An interface between the passivation layer and the UBM layers has a first unevenness surface, an interface between the passivation layer and the first redistribution layer has a second unevenness surface, connected to the first unevenness surface, and the second unevenness surface has a surface roughness greater than a surface roughness of the second redistribution layer.

公开(公告)号：US20180097983A1

公开(公告)日：2018-04-05

申请号：US15721435

申请日：2017-09-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Hyoung PARK ,  Byung Ho KIM ,  Jae Joon MOON ,  Jeong Won LEE ,  Han Sung KIM ,  Woo Seok CHOI ,  Shuichi SHIMOKAWA ,  Takafumi USUI

IPC: H04N5/235 ,  H04N5/232 ,  H04N9/69

CPC classification number: H04N5/2355 ,  H04N5/23267 ,  H04N5/23277 ,  H04N5/35536 ,  H04N9/69

Abstract: An electronic device includes a lens part that receives light from a subject, an image sensor that receives the light of the lens part from a group of pixels arranged two-dimensionally, and an processor that processes an image signal of the image sensor. The image sensor performs a read-out operation at a speed to prevent blurring of an image. The processor temporarily stores image data by the read-out operation in a memory, loads a plurality of images stored in the memory to generate an image, of which the number of bits is expanded compared with the image signal of the image sensor, and performs gamma processing on the image, of which the number of bits is expanded, to generate an image compressed to the same number of bits as the image signal of the image sensor.

公开(公告)号：US20250006696A1

公开(公告)日：2025-01-02

申请号：US18525724

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkoon LEE ,  Youngchan KO ,  Byung Ho KIM

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/522 ,  H01L25/00

Abstract: A semiconductor package may include a first redistribution layer, bridge dies on an upper surface of the first redistribution layer, a second redistribution layer on the bridge dies and electrically connected to the bridge dies, conductive posts between the first and second redistribution layer, and semiconductor chips on an upper surface of the second redistribution layer. Each bridge die may include connection pads on an upper surface of the bridge dies. A pitch between first connection pads of a first bridge die among the bridge dies may be smaller than a pitch between second connection pads of a second bridge die among the bridge dies. A distance between an upper surface of the first bridge die and a lower surface of the second redistribution layer may be smaller than a distance between an upper surface of the second bridge die and a lower surface of the second redistribution layer.

公开(公告)号：US20200075517A1

公开(公告)日：2020-03-05

申请号：US16282980

申请日：2019-02-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Ho KIM ,  Jae Hoon CHOI ,  Joo Young CHOI

IPC: H01L23/00

Abstract: A semiconductor package includes a connection member having first and second surfaces opposing each other and including at least one insulating layer and redistribution layer, the redistribution layer including a via penetrating through the insulating layer and a RDL pattern connected to the via while being located on an upper surface of the insulating layer; a semiconductor chip disposed on the first surface and including a connection pad connected to the redistribution layer; and an encapsulant disposed on the first surface and encapsulating the semiconductor chip. The redistribution layer includes a seed layer disposed on a surface of the insulating layer and a plating layer disposed on the seed layer. An interface between the insulating layer and a portion of the seed layer constituting the via includes a first uneven surface with a surface roughness of 30 nm or more.

公开(公告)号：US20180176470A1

公开(公告)日：2018-06-21

申请号：US15791976

申请日：2017-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Young KIM ,  Dong Eui SHIN ,  Jae Hyoung PARK ,  Jeong Won LEE ,  Byung Ho KIM

IPC: H04N5/232 ,  H04N5/225 ,  H04N5/235

CPC classification number: H04N5/23287 ,  G03B5/02 ,  G03B15/16 ,  G03B2205/0007 ,  H04N5/2258 ,  H04N5/2259 ,  H04N5/23216 ,  H04N5/23254 ,  H04N5/23258 ,  H04N5/23293 ,  H04N5/23296 ,  H04N5/2353

Abstract: An electronic device is provided. The electronic device includes at least one lens, an image sensor, an optical image stabilization (OIS) module configured to move at least one of the image sensor or the at least one lens in relation to OIS, and an image processor electrically connected with the OIS module. The image processor is configured to control movement of the at least one lens in a specified direction by using the OIS module, and obtain a panning shot image of a moving subject while moving the at least one lens